A kind of copper etchant and its preparation method and application

Abstract

The invention provides a copper etching solution and its preparation method and application. The copper etching solution comprises the following components: acid calculated as its solute 100-200g / L, tetravalent cerium salt 200-500g / L and auxiliary agent 0.01-10g / L; the solvent of the copper etching solution is water; The auxiliary agent is any one or a mixture of at least two of imidazole compounds, sulfonic acid compounds or polyamines. The copper etching solution described in the present invention can ensure high etching efficiency, and at the same time satisfy the high soluble copper content of the etching solution, and not only have excellent stability during the etching process, but also can largely avoid excessive copper side erosion and undercutting of bottom copper The problem. Moreover, after the copper etching reaction occurs, copper can be quickly recovered without any treatment.

Description

technical field [0001] The invention belongs to the field of chemical etching, in particular to a copper etching solution and its preparation method and application. Background technique [0002] With the development of information technology, the role of electronic products in modern society has become more and more important, and they are widely used in various industrial fields. In recent years, with the miniaturization, thinning, lightening, and high performance of electronic equipment, the printed circuit boards used have become smaller and more integrated. Etching of copper layers is a particularly important process in the manufacture of printed circuit boards. In the etching process, acid etching is an essential process in the process of manufacturing printed circuit boards, and the acid etching process is completed in an etching machine using an acid etching solution. [0003] For the etching of printed circuits, it is required to have fast etching speed, less side...

AI Technical Summary

Problems solved by technology

The copper etching solution uses acid composite oxidation to etch copper, but the stability of the system is poor, and the etching rate of the etching solution at high temperature is still slow, resulting in low etching efficiency, low etching precision, and prone to defects

[0005] CN107099799A discloses a copper chloride etching solution and a preparation method thereof, which is made of etching mother solution and etching sub-liquid, and the etching mother solution includes the following raw materials in parts by weight: sodium carboxymethylcellulose, boric acid, methyl butyrate , benzoyl chloride, sodium p-toluenesulfonamide N-chloride, barium stearate, azobisisobutyronitrile, ferric chloride, hydrofluoric acid, phosphoric acid, methoxyacetic acid, dichromic acid Potassium, diethanolamine and triethanolamine. Although the copper chloride etching solution has excellent stability, it has the problem of large amount of side etching or undercutting of the bottom copper.

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