Sulfur ion implanted nano-diamond-graphene composite film electrode and preparation method thereof
A composite technology of nano-diamond and graphene, which is applied in the direction of ion implantation plating, metal material coating process, superimposed layer plating, etc. In the field of high-precision electrochemical detection, the influence of electrical and electrochemical properties, etc., to achieve excellent electrochemical activity, improve electrical conductivity and electrochemical properties, and increase the electrochemical active area
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Embodiment 1
[0042] Mix diamond powder (purchased from Shanghai Jiye Abrasives Co., Ltd., model w1) and glycerin (glycerol) in a ratio of 1 g: 100 ml, stir evenly with a glass rod, and place it in an ultrasonic cleaner for ultrasonic dispersion for 5 minutes to make it. It is fully and evenly dispersed to form a diamond powder grinding paste, which is reserved for later use; take an appropriate amount of the prepared diamond powder grinding paste on the polishing flannel, and polish the single crystal silicon wafer for 30 minutes; The silicon wafers were ultrasonically cleaned successively in acetone and alcohol solutions for 5 minutes; the cleaned silicon wafers were blown dry with a nitrogen gun, and wrapped with lens tissue for use.
[0043]The single crystal silicon substrate after the seed crystal is put into the hot wire chemical vapor deposition equipment, and acetone is used as the carbon source, and the acetone is brought into the reaction chamber by means of hydrogen bubbling. Th...
Embodiment 2
[0052] Mix diamond powder (purchased from Shanghai Jiye Abrasives Co., Ltd., model w1) and glycerin (glycerol) in a ratio of 1 g: 100 ml, stir evenly with a glass rod, and place it in an ultrasonic cleaner for ultrasonic dispersion for 5 minutes to make it. It is fully and evenly dispersed to form a diamond powder grinding paste, which is reserved for later use; take an appropriate amount of the prepared diamond powder grinding paste on the polishing flannel, and polish the single crystal silicon wafer for 30 minutes; The silicon wafers were ultrasonically cleaned in acetone and alcohol solutions for 5 minutes successively; the cleaned silicon wafers were blown dry with a nitrogen gun, and wrapped with lens tissue for use.
[0053] The single crystal silicon substrate after the seed crystal is put into the hot wire chemical vapor deposition equipment, and acetone is used as the carbon source, and the acetone is brought into the reaction chamber by means of hydrogen bubbling. T...
Embodiment 3
[0062] Mix diamond powder (purchased from Shanghai Jiye Abrasives Co., Ltd., model w1) and glycerin (glycerol) in a ratio of 1 g: 100 ml, stir evenly with a glass rod, and place it in an ultrasonic cleaner for ultrasonic dispersion for 5 minutes to make it. It is fully and evenly dispersed to form a diamond powder grinding paste, which is reserved for later use; take an appropriate amount of the prepared diamond powder grinding paste on the polishing flannel, and polish the single crystal silicon wafer for 30 minutes; The silicon wafers were ultrasonically cleaned in acetone and alcohol solutions for 5 minutes successively; the cleaned silicon wafers were blown dry with a nitrogen gun, and wrapped with lens tissue for use.
[0063] The single crystal silicon substrate after the seed crystal is put into the hot wire chemical vapor deposition equipment, and acetone is used as the carbon source, and the acetone is brought into the reaction chamber by means of hydrogen bubbling. T...
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