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Composite material and sheet for microwave circuit base plate, and microwave circuit base plate and preparation method thereof

A circuit substrate and composite material technology, which is applied in the field of printed circuit substrate and its manufacturing, can solve the problems of limited use value, low strength of turning materials, and easy cracks, etc., and achieve increased strength, low porosity, and stable dielectric properties. Effect

Inactive Publication Date: 2020-05-22
上海安缔诺科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The turning process can continuously produce sheets with a larger width, but it is generally suitable for processing pure PTFE or PTFE materials with less filler content, such as for the preparation of the bonding layer of PTFE copper-clad laminates. For substrates with high filler content, its The turning material has low strength and is prone to cracks, which greatly limits its use value

Method used

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  • Composite material and sheet for microwave circuit base plate, and microwave circuit base plate and preparation method thereof
  • Composite material and sheet for microwave circuit base plate, and microwave circuit base plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Weigh 15kg of PTFE emulsion (Daikin D210, PTFE solid content 60%), add water to dilute to 40wt% concentration, hexagonal boron nitride (D50=15 micron, flake, Suzhou Napo Material Technology Co., Ltd.) 6kg, coupling agent CG-P13 30g, use a mixer to mix for 1h at a speed of 600rpm to get a uniformly mixed glue.

[0036] Slowly add ethanol to the above glue solution until a muddy solid precipitate appears, centrifuge to remove the supernatant, and dry the remaining slurry mixture at 120° C. to obtain a slightly agglomerated solid.

[0037] The obtained solid powder was crushed through a 40-mesh sieve, and then No. 200 solvent oil was added according to a mass ratio of 10 wt%, mixed evenly and aged for 5 hours.

[0038] Add the cured powder into a low-speed mixer and stir for 30 minutes, and it is observed that the powder is fibrous.

[0039] The fibrous powder was treated in an oven at 300°C for 5 hours to remove lubricants and additives in the emulsion.

[0040] The abo...

Embodiment 2

[0045] Weigh 15kg of PTFE emulsion (Daikin D210, PTFE solid content 60%), add water to dilute to 40wt% concentration, hexagonal boron nitride (D50=15 micron, flake, Suzhou Napo Material Technology Co., Ltd.) 6kg, coupling agent Z-6132 30g, glass fiber powder 1kg (giant stone EMG13-250, 13 microns in diameter, 50 microns in length), rotating speed 600rpm, to obtain a uniformly mixed glue.

[0046] Slowly add ethanol to the above glue solution until a muddy solid precipitate appears, centrifuge to remove the supernatant, and dry the remaining slurry mixture at 120° C. to obtain a slightly agglomerated solid.

[0047] The obtained solid powder was crushed through a 40-mesh sieve, and then No. 200 solvent oil was added according to a mass ratio of 10 wt%, mixed evenly and aged for 5 hours.

[0048] Add the cured powder into a low-speed mixer and stir for 30 minutes, and it is observed that the powder is fibrous.

[0049] The fibrous powder was treated in an oven at 300°C for 5 ho...

Embodiment 3

[0055] Take by weighing PTFE emulsion 12.5kg (Daikin D210, PTFE solid content 60%), add water and dilute to 40wt% concentration, silicon micropowder (D50=20 μ m, Lianyungang Warwick Silicon Micropowder Co., Ltd.) 7.5kg, coupling agent KH-1621 40g, Use a mixer to mix for 1 hour at a speed of 600 rpm to obtain a uniformly mixed glue solution.

[0056] Slowly add ethanol to the above glue until a muddy solid precipitate appears, centrifuge to remove the supernatant, and dry the remaining slurry mixture at 120°C to obtain a slightly agglomerated solid;

[0057] Break the obtained solid powder through a 40-mesh sieve, then add No. 200 solvent oil according to the mass ratio of 10wt%, mix evenly, and mature for 5 hours;

[0058] Add the cured powder into a low-speed mixer and stir for 30 minutes, and it is observed that the powder is fibrous;

[0059] Treat the fibrous powder in an oven at 300°C for 5 hours to remove lubricants and additives in the emulsion;

[0060] The above pow...

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Abstract

The invention provides a composite material and a sheet for a microwave circuit base plate, and the microwave circuit base plate and a preparation method thereof. The preparation method of the composite material comprises the following steps: 1) mixing a polytetrafluoroethylene dispersion emulsion, an inorganic filler and a coupling agent to obtain a glue solution; 2) adding a settling agent intothe glue solution, demulsifying, centrifugally separating to obtain a slurry mixture, and drying the slurry mixture to obtain a solid; 3) crushing the solid to obtain powder, mixing the powder and a lubricant, and aging to obtain an aged material; 4) stirring the aged material to fibrillate the aged material to obtain a fibrillated material; 5) heating the fibrillated material to remove the lubricant to obtain powder; 6) conducting isostatic pressing on the powder in a mold to obtain a hollow round billet, and conducting heat treatment to remove internal stress; 7) sintering the hollow round billet; and 8) conducting rotary cutting on the round billet to form continuous sheets. The sheet prepared from the composite material can achieve large-area industrial production and has stable dielectric properties.

Description

technical field [0001] The invention relates to the field of printed circuit board substrates, in particular to a printed circuit substrate and a manufacturing method thereof. Background technique [0002] In order to adapt to the increasingly stringent requirements for substrates in high-frequency signal transmission, especially in the millimeter wave field, the development and application of liquid crystal polymers, polyphenylene ethers, hydrocarbon resins, and polytetrafluoroethylene substrates has attracted great attention from the market. In particular, polytetrafluoroethylene substrate has the most excellent dielectric properties and has become a hot spot in research and development. Due to its high thermal expansion coefficient, polytetrafluoroethylene is generally used in two forms when applied to circuit board substrates. One is to mix a small amount of inorganic filler (less than 30wt%) and obtain varnished cloth by impregnating glass fiber cloth, glass fiber Clot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K9/00C08K3/38
CPCC08K3/38C08K9/00C08K2003/385C08L27/18
Inventor 韩瑞金石磊李小慧侯李明刘锋
Owner 上海安缔诺科技有限公司
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