LED epitaxial growth method for improving radiation recombination efficiency
A technology of epitaxial growth and recombination efficiency, which is applied in the field of LED epitaxial growth to improve radiation recombination efficiency, can solve the problems of low quantum well growth quality and low quantum well radiation recombination efficiency, and achieves improved luminous efficiency, improved LED luminous efficiency, The effect of reducing dislocation density
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[0041] Example 1
[0042] This embodiment adopts the LED epitaxial growth method for improving radiation recombination efficiency provided by the present invention, and uses MOCVD to grow GaN-based LED epitaxial wafers, and uses high-purity H 2 Or high purity N 2 Or high purity H 2 And high purity N 2 Mixed gas as carrier gas, high purity NH 3 As the N source, metal organic source trimethyl gallium (TMGa) is used as gallium source, trimethyl indium (TMIn) is used as indium source, and the N-type dopant is silane (SiH 4 ), trimethyl aluminum (TMAl) is used as the aluminum source, and the P-type dopant is magnesium cerocene (CP 2 Mg), the reaction pressure is between 70 mbar and 900 mbar. The specific growth method is as follows (please refer to the epitaxial structure figure 1 ):
[0043] An LED epitaxial growth method for improving radiation recombination efficiency, which in turn includes: processing a substrate 1, growing a low-temperature buffer layer GaN2, growing an undoped GaN...
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[0074] Example 2
[0075] The following provides a comparative example, namely the growth method of the traditional LED epitaxial structure (for the epitaxial structure please refer to figure 2 ).
[0076] Step 1: At a temperature of 1000-1100°C, a reaction chamber pressure of 100-300mbar, and 100-130L / min of H 2 Under the conditions, process the sapphire substrate for 5-10 minutes.
[0077] Step 2: Growing a low-temperature GaN buffer layer, and forming irregular islands on the low-temperature GaN buffer layer 2.
[0078] Specifically, the step 2 further includes:
[0079] At the temperature of 500-600℃, the pressure of the reaction chamber is 300-600mbar, and NH of 10000-20000sccm is introduced 3 , 50-100sccm of TMGa, 100-130L / min of H 2 Growing the low-temperature GaN buffer layer 2 on the sapphire substrate 1, and the thickness of the low-temperature GaN buffer layer 2 is 20-40 nm;
[0080] At the temperature of 1000-1100℃, the pressure of the reaction chamber is 300-600mbar, and t...
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