Underfill adhesive and preparation method thereof

Abstract

The invention relates to the technical field of colloidal fillers. The invention particularly relates to an underfill adhesive. The underfill adhesive comprises the following raw materials in parts byweight: 40-50 parts of epoxy resin, 5-40 parts of a curing agent, 10-30 parts of a light-cured monomer and resin, 1-10 parts of a resin toughening agent, 0.1-5 parts of a diluent, 1-5 parts of an initiator, 0.1-0.5 part of a defoaming agent, 0.1-3 parts of a silane coupling agent and 0-1.5 parts of other additives. The underfill adhesive provided by the invention has low viscosity, low shrinkageand low expansion coefficient, can well absorb infrared wavelength emitted by a laser, and can be quickly cured by laser; the invention further provides a preparation method of the underfill adhesive,the preparation method is simple in process and easy to operate, and the prepared underfill adhesive is good in performance.

Description

technical field [0001] The invention relates to the technical field of gel fillers, in particular to an underfill gel and a preparation method thereof. Background technique [0002] The underfill glue is to underfill the chip in the BGA package mode, and fill 80% of the space at the bottom of the BGA through capillary action. Underfill glue is widely used in circuit board packaging of portable electronic products such as MP3, USB, mobile phones, and Bluetooth. With the continuous development of the electronic information industry and continuous innovation of technology, the requirements for packaging technology of electronic products are also getting higher and higher. IC packaging is required to have the advantages of high density, small volume, low power consumption, faster, less delay and low cost. In order to meet the higher technical requirements of IC packaging, better underfill performance is required. [0003] At present, underfills on the market have defects such a...

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Problems solved by technology

[0003] At present, underfills on the market have defects such as high viscosity, slow flow speed, high thermal expansion coefficient, low curing efficiency, high curing shrinkage, and poor reliability. At the same time, because the existing underfills cannot better absorb laser emissions Infrared wavelength, so the existing underfill curing method is generally heated by electric oven or infrared oven, through the oven heating and curing method, while heating the filler, the entire workpiece needs to be heated, which may cause It will cause irreversible damage to workpieces with poor local heat resistance, and requires high energy consumption and low curing efficiency; furthermore, if electric oven or infrared oven is used for heating, the heating temperature of the bottom filling glue is not uniform, resulting in long curing time , the curing effect is poor, resulting in a high defect rate of the product

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