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High-thermal-conductivity modified polytetrafluoroethylene copper-clad plate and preparation method thereof

A polytetrafluoroethylene, copper clad laminate technology, applied in chemical instruments and methods, printed circuit manufacturing, other household appliances, etc., can solve the problems of low thermal conductivity of PTFE copper clad laminates, affecting the heat dissipation performance of printed circuit boards, etc. It is beneficial to energy consumption and stress transfer, improving the effect of easy agglomeration and precipitation, and improving dispersion uniformity and stability

Pending Publication Date: 2020-06-09
无锡睿龙新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional preparation method of PTFE copper-clad laminate is to impregnate glass fiber cloth with PTFE emulsion. After drying the water at a temperature of about 100 ° C, several pieces of PTFE impregnated cloth are superimposed and sintered with copper-clad foil to obtain PTFE copper-clad laminate. PTFE prepared by traditional methods The low thermal conductivity of copper clad laminates seriously affects the heat dissipation performance of printed circuit boards (PCBs). Therefore, it is of great significance to develop a PTFE copper clad laminate with high thermal conductivity.

Method used

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  • High-thermal-conductivity modified polytetrafluoroethylene copper-clad plate and preparation method thereof
  • High-thermal-conductivity modified polytetrafluoroethylene copper-clad plate and preparation method thereof

Examples

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Embodiment 1

[0026] A preparation method of a high thermal conductivity modified polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0027] (1) Pretreatment of glass fiber cloth

[0028] The glass fiber cloth was heated at 450°C for 30 minutes, the surface paraffin was removed, and the heat-treated glass fiber cloth was immersed in z-6032 silane coupling agent modification solution (cationic styryl amino, Dow Corning, the same below) for 10 minutes, After natural air-drying, bake at 115℃ for 30min, set aside;

[0029] (2) Preparation of glue

[0030] First, 45 parts by weight of polytetrafluoroethylene PTFE emulsion (solid content 60wt.%, viscosity 5*10 -3 Pa.S, average particle size 0.25μm, number average relative molecular weight 1.0*10 7 , Sanaifu Company, the same below) and 50 parts by weight of polytetrafluoroethylene propylene PFEP emulsion (solid content 50wt.%, viscosity 2*10 -3 Pa.S, average particle size 0.3μm, number average relative molecular we...

Embodiment 2

[0036] A preparation method of a high thermal conductivity modified polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0037] (1) Pretreatment of glass fiber cloth

[0038]The glass fiber cloth was heated at 450°C for 30 minutes, the surface paraffin was removed, and the heat-treated glass fiber cloth was immersed in z-6032 silane coupling agent modification solution (cationic styryl amino, Dow Corning, the same below) for 10 minutes, After natural air-drying, bake at 115℃ for 30min, set aside;

[0039] (2) Preparation of glue

[0040] First, 45 parts by weight of polytetrafluoroethylene PTFE emulsion (solid content 60wt.%, viscosity 5*10 -3 Pa.S, average particle size 0.25μm, number average relative molecular weight 1.0*10 7 , Sanaifu Company, the same below) and 55 parts by weight of polytetrafluoroethylene propylene PFEP emulsion (solid content 50wt.%, viscosity 2*10 -3 Pa.S, average particle size 0.3μm, number average relative molecular wei...

Embodiment 3

[0046] A preparation method of a high thermal conductivity modified polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0047] (1) Pretreatment of glass fiber cloth

[0048] The glass fiber cloth was heated at 450°C for 30 minutes, the surface paraffin was removed, and the heat-treated glass fiber cloth was immersed in z-6032 silane coupling agent modification solution (cationic styryl amino, Dow Corning, the same below) for 10 minutes, After natural air-drying, bake at 115℃ for 30min, set aside;

[0049] (2) Preparation of glue

[0050] First, 45 parts by weight of polytetrafluoroethylene PTFE emulsion (solid content 60wt.%, viscosity 5*10 -3 Pa.S, average particle size 0.25μm, number average relative molecular weight 1.0*10 7 , Sanaifu Company, the same below) and 58 parts by weight of polytetrafluoroethylene propylene PFEP emulsion (solid content 50wt.%, viscosity 2*10 -3 Pa.S, average particle size 0.3μm, number average relative molecular we...

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Abstract

The invention discloses a high-thermal-conductivity modified polytetrafluoroethylene copper-clad plate and a preparation method thereof, which belong to the technical field of copper-clad plates. Themethod comprises the following steps: firstly, pretreating glass fiber cloth by adopting a silane coupling agent; then, preparing a PTFE / PFEP / L-tryptophan modified graphene oxide dispersion glue solution; impregnating the glass fiber cloth pretreated by the silane coupling agent in the glue solution, drying to obtain an impregnated film, laminating the impregnated film into a raw substrate with aspecified thickness, and covering copper foils on the two sides of the raw substrate for hot pressed sintering to obtain the modified PTFE copper-clad plate. The method is simple to operate, and the copper-clad plate prepared by the method has high thermal conductivity and excellent electrical performance.

Description

technical field [0001] The invention relates to a copper clad laminate and a preparation method thereof, in particular to a high thermal conductivity modified polytetrafluoroethylene copper clad laminate and a preparation method thereof, belonging to the technical field of copper clad laminates. Background technique [0002] Polytetrafluoroethylene (PTFE) has excellent electrical properties (low dielectric constant, low dielectric loss factor, very stable in higher temperature and frequency ranges), as well as good chemical stability and thermal stability, and is widely used. Used in communications equipment, computers, automotive electronics, household appliances and other manufacturing industries. The traditional preparation method of PTFE copper clad laminate is to impregnate glass fiber cloth with PTFE emulsion. After drying the moisture at a temperature of about 100 °C, stack several PTFE impregnated cloths with copper clad foil and sinter to obtain PTFE copper clad lam...

Claims

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Application Information

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IPC IPC(8): B32B17/02B32B17/12B32B15/14B32B15/20B32B38/00B32B38/08B32B38/16B32B37/06B32B37/10C08L27/18C08L71/02C08K9/04C08K3/04H05K3/02
CPCB32B5/02B32B5/26B32B15/20B32B15/14B32B38/0036B32B38/08B32B38/164B32B37/06B32B37/10C08L27/18H05K3/022B32B2260/02B32B2260/046B32B2262/101B32B2250/40B32B2307/302B32B2311/12B32B2457/08C08L2205/03C08L2205/025C08L71/02C08K9/04C08K3/042
Inventor 向中荣
Owner 无锡睿龙新材料科技有限公司
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