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Photo-thermal response three-dimensional shape memory polyimide, preparation method and application thereof

A three-dimensional shape, photothermal response technology, applied in the field of functional materials, can solve problems such as inability to obtain three-dimensional shapes

Inactive Publication Date: 2020-06-19
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the reported polyimide materials have obtained high glass transition temperature and excellent shape memory properties, the shapes of the shape memory polyimides reported so far are limited to thin films, and complex three-dimensional shapes cannot be obtained.
And the stimulus for shape recovery is mainly heating, which limits the application of high-temperature shape memory polymers as actuators in complex environments.

Method used

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  • Photo-thermal response three-dimensional shape memory polyimide, preparation method and application thereof

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preparation example Construction

[0026] The invention provides a method for preparing photothermally responsive three-dimensional shape memory polyimide, comprising the following steps:

[0027] (1) mixing diamine, photothermal nanoparticles and a solvent to obtain a mixed solution;

[0028] (2) mixing the mixed solution and dianhydride to carry out polycondensation reaction to obtain a polyamic acid solution;

[0029] (3) coating the polyamic acid solution on the hard thin-layer substrate, then heating to volatilize the solvent, and obtaining a polyamic acid film on the surface of the hard thin-layer substrate;

[0030] (4) The polyamic acid film and the hard thin layer substrate at the bottom are prepared into a three-dimensional structure, and then thermal imidization is performed, and then the hard thin layer substrate is peeled off to obtain a photothermal responsive three-dimensional shape memory polyimide.

[0031] The invention mixes the diamine, photothermal nanoparticles and solvent to obtain a mix...

Embodiment 1

[0044] Add 4,4'-diaminodiphenyl ether (5mmol) and 2-(4-aminophenyl)-5-aminobenzoxazole (5mmol) into N-methyl-2-pyrrolidone, dry at room temperature Stir under a nitrogen atmosphere until dissolved, then add enhanced graphene (2 to 5 layers, the addition amount is 1 wt% of the total mass of dianhydride and diamine), and ultrasonically disperse it evenly. Then add 3,3',4,4'-biphenyldianhydride (10mmol), stir for 24h under nitrogen atmosphere and ice-water bath condition, carry out polycondensation reaction, obtain polyamic acid solution; Cover on a horizontal aluminum thin-layer substrate, heat in an oven at 80°C for 24 hours to volatilize the solvent, and cool to normal temperature to obtain a polyamic acid film.

[0045] The polyamic acid film with the aluminum thin-layer base is laser cut to obtain the desired pattern, and then deformed into a three-dimensional cylinder by origami technology. Then thermal imidization was performed on the obtained three-dimensional cylindrica...

Embodiment 2

[0051] Add 4,4'-diaminodiphenyl ether (5mmol) and 2-(4-aminophenyl)-5-aminobenzoxazole (5mmol) into N-methyl-2-pyrrolidone, dry at room temperature Stir under a nitrogen atmosphere until dissolved, then add iron ferric oxide nanoparticles (the addition amount is 0.5wt% of the total mass of dianhydride and diamine), and ultrasonically disperse them evenly. Then add 3,3',4,4'-biphenyldianhydride (10mmol), stir for 24h under nitrogen atmosphere and ice-water bath condition, carry out polycondensation reaction, obtain polyamic acid solution; Cover on a horizontal aluminum thin-layer substrate, heat in an oven at 80°C for 24 hours to volatilize the solvent, and cool to normal temperature to obtain a polyamic acid film.

[0052] The polyamic acid film with the aluminum thin layer substrate is laser cut to obtain the desired pattern, and then deformed into the shape of a sunflower by origami technology. The obtained sunflower-like three-dimensional structure was subjected to thermal...

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Abstract

The invention relates to the technical field of functional materials, and provides photo-thermal response three-dimensional shape memory polyimide, a preparation method and application thereof. The preparation method comprises the following steps: mixing photo-thermal nanoparticles, diamine and dianhydride, synthesizing polyamic acid through in-situ condensation polymerization, dispersing the photo-thermal nanoparticles in the polyamide acid, coating a hard thin-layer substrate with the polyamic acid, and volatilizing the solvent to obtain a polyamic acid film; and preparing a three-dimensional structure from the polyamic acid film and the hard thin-layer substrate at the bottom, and removing the substrate after thermal imidization to obtain the photo-thermal response three-dimensional shape memory polyimide. According to the invention, shape memory polyimide with a complex three-dimensional structure can be obtained, and the obtained shape memory polyimide can realize dual response tolight and heat; and the photo-thermal response three-dimensional shape memory polyimide provided by the invention is high in glass-transition temperature, high in mechanical strength and excellent inshape memory performance, and can be used as a driver in harsh and complex environments such as high temperature.

Description

technical field [0001] The invention relates to the technical field of functional materials, in particular to a photothermal responsive three-dimensional shape memory polyimide and its preparation method and application. Background technique [0002] Shape memory polymers and their composites are widely used in aerospace, biomedicine and other fields due to their light weight, adjustable performance and excellent mechanical properties. However, commonly used shape memory polymers such as polyurethane, epoxy resin, polystyrene, and polynorbornene have low transition temperatures and low mechanical strength, which limits their application in complex environments such as high temperature and strong irradiation. [0003] Due to the advantages of high glass transition temperature, high mechanical strength, good thermal stability and excellent shape memory performance, shape memory polyimide has been widely studied in recent years, and has great application prospects in harsh and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/04C08K7/00C08K3/22C08K3/02C08J5/18C08L79/08
CPCC08G73/1042C08G73/1071C08G73/1085C08G2280/00C08J5/18C08J2379/08C08K3/02C08K3/041C08K3/042C08K3/22C08K7/00C08K2003/026C08K2003/2275C08K2201/011
Inventor 杨增辉王齐华张耀明张新瑞王廷梅
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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