Modified phenolic resin material and preparation method thereof

A technology for modification of phenolic resin, applied in the field of modified phenolic resin materials and their preparation, can solve the problems of improving the toughness of phenolic resin materials, and achieve the effects of improving toughness, improving impact strength and heat resistance, and increasing strength

Inactive Publication Date: 2020-07-28
郭芳芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the invention did not effectively improve the toughness of phenolic resin materials, so the development of a phenolic resin foam material with higher toughness is very necessary for the development of thermal insulation materials

Method used

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  • Modified phenolic resin material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A modified phenolic resin material, comprising the following raw materials in parts by weight: 100 parts of cashew nut shell oil modified phenolic resin, 15 parts of hydroxyl-terminated liquid polybutadiene rubber, SiO 2 6 parts of coated carbon fiber, 2 parts of silicon powder, 0.6 part of silane coupling agent KH550, 7 parts of n-pentane, 0.5 part of 2,6-di-tert-butyl-4-methylphenol, 6 parts of hexamethylenetetramine .

[0030] Cashew nut shell oil modified phenolic resin is prepared by the following method: add cashew nut shell oil, phenol and sodium hydroxide into the reactor, stir evenly, add formaldehyde solution while stirring, and control the system temperature between 60-65 °C After the formaldehyde solution is added, the temperature is raised to 80-85°C for 2 hours, and then the temperature is raised to 100-105°C for 1.5 hours; after the reaction, dehydration is carried out to obtain cashew nut shell oil modified phenolic resin. Among them, the molar ratio of...

Embodiment 2

[0033] A modified phenolic resin material, comprising the following raw materials in parts by weight: 100 parts of cashew nut shell oil modified phenolic resin, 18 parts of hydroxyl-terminated liquid polybutadiene rubber, SiO 2 4 parts of coated carbon fiber, 2 parts of zirconia, 0.7 parts of silane coupling agent KH560, 8 parts of n-pentane, 0.5 parts of 2,6-di-tert-butyl-4-methylphenol, 5 parts of hexamethylenetetramine .

[0034]Cashew nut shell oil modified phenolic resin is prepared by the following method: add cashew nut shell oil, phenol and sodium hydroxide into the reactor, stir evenly, add formaldehyde solution while stirring, and control the system temperature between 60-65 °C After the formaldehyde solution is added, the temperature is raised to 80-85° C. for 1.5-2 hours, and then the temperature is raised to 110-115° C. for 1.5 hours; after the reaction is completed, dehydration is carried out to obtain cashew nut shell oil modified phenolic resin. Among them, th...

Embodiment 3

[0037] A modified phenolic resin material, comprising the following raw materials in parts by weight: 100 parts of cashew nut shell oil modified phenolic resin, 20 parts of hydroxyl-terminated liquid polybutadiene rubber, SiO 2 8 parts of coated carbon fiber, 2 parts of zirconia, 0.8 parts of silane coupling agent KH570, 8 parts of n-pentane, 0.6 parts of 2,6-di-tert-butyl-4-methylphenol, 5 parts of hexamethylenetetramine .

[0038] Cashew nut shell oil modified phenolic resin is prepared by the following method: add cashew nut shell oil, phenol and sodium hydroxide into the reactor, stir evenly, add formaldehyde solution while stirring, and control the system temperature between 65-70°C After the formaldehyde solution is added, the temperature is raised to 85-90°C for 1.5h, and then the temperature is raised to 110-115°C for 1h; after the reaction, dehydration is carried out to obtain cashew nut shell oil modified phenolic resin. Among them, the molar ratio of cashew nut she...

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Abstract

The invention provides a modified phenolic resin material and a preparation method thereof, and relates to the technical field of polymer materials. The modified phenolic resin material is prepared from the following raw materials in parts by weight: 100 parts of cashew nut shell oil modified phenolic resin, 10 to 20 parts of hydroxyl-terminated liquid polybutadiene rubber, 3 to 8 parts of SiO2 coated carbon fibers, 1 to 3 parts of an inorganic filler, 0.5 to 0.8 part of a silane coupling agent, 5 to 9 parts of a foaming agent, 0.3 to 0.6 part of an antioxidant and 3 to 6 parts of a curing agent. The modified phenolic resin material is high in toughness, high in strength, excellent in heat resistance and flame retardance, good in heat insulation effect and extremely low in free formaldehyde content.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a modified phenolic resin material and a preparation method thereof. Background technique [0002] Phenolic resin is formed by polycondensation of phenol and formaldehyde under the action of an acidic or basic catalyst. It has a history of about one hundred years and is one of the most widely used thermosetting resins. Its raw materials are easy to obtain and low in price, and exhibit excellent mechanical properties, thermal stability, ablation resistance and high carbon residue rate. These products can not only be used in high-end aerospace fields, military equipment, etc., but also widely used in molding compounds, friction materials, insulating materials, wood bonding, coatings, inks, casting, construction and microelectronics. Due to the presence of a large number of methine groups in the molecules of phenolic resin, when subjected to external force, the methine br...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/08C08L15/00C08K13/06C08K9/10C08K7/06C08K3/36C08K3/34C08K3/22C08K5/13C08K5/544C08K5/5435C08K5/5425C08J9/14C08J3/24C08G8/08C08G8/10
CPCC08G8/08C08G8/10C08J3/246C08J9/0023C08J9/0042C08J9/0061C08J9/0066C08J9/0085C08J9/009C08J9/0095C08J9/141C08J2203/14C08J2361/08C08J2415/00
Inventor 郭芳芳
Owner 郭芳芳
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