Surface multi-material metallization method for three-dimensional stacked resin encapsulation module

Abstract

The invention relates to a surface multi-material metallization method for a three-dimensional stacked resin encapsulation module. The method comprises the following steps of step 1 of impacting the surface of the encapsulation module by using carborundum particles, and then corroding the impacted surface of the encapsulation module by using corrosive liquid; step 2 of emulsifying oil stains on the surface of the encapsulation module and then soaking the emulsified oil stains in a hydroxyethyl ethylenediamine solution for surface electrical adjustment; step 3 of sequentially soaking the encapsulation module in a mixed solution of sulfuric acid and sodium fluoride, a colloidal palladium solution and a sodium chlorite solution; and step 4 of sequentially carrying out chemical nickel platingand nickel-gold electroplating on the encapsulation module. According to the method, chemical nickel plating pretreatment is improved mainly through a weakly acidic composite coarsening solution and aweakly micro-etching solution, an electroplated nickel layer is activated through a mixed acid solution, coarsening of multiple materials on the surface of the module is stably achieved, the bindingforce of a plating layer on the surface of the module is enhanced, the effect is good, and the state is stable.

Description

technical field [0001] The invention relates to the technical field of electronic electroplating, in particular to a multi-material metallization method for the surface of a three-dimensional stacked resin potting module. Background technique [0002] Three-dimensional stacked resin potting modules are widely used in space electronic products due to their advantages of small size, low power consumption, high density and large storage. According to the assembly process requirements of the three-dimensional stacked resin potting module, the module needs to be electroless nickel-plated and electro-nickel-gold-plated on the surface after potting and shape cutting. The purpose is to realize the interconnection between the substrates through the surface coating of the potting body. [0003] The quality of the coating on the surface of the three-dimensional stacking resin potting module directly affects the functionality and reliability of the module. Because the conventional plast...

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Problems solved by technology

[0003] The quality of the coating on the surface of the three-dimensional stacking resin potting module directly affects the functionality and reliability of the module. Because the conventional plastic electroless nickel plating method has certain limitations for this multi-material three-dimensional stacking resin potting module on the surface, the coating cannot be guaranteed. Bonding force with different materials

[0004] Therefore, when designing the surface coating process of three-dimensional stacked resin potting modules, it is necessary to combine different materials with pre-plating treatment methods, but there is no relevant report so far.

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