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Copper-based bonding wire with nickel-plated surface and preparation method thereof

A bonding wire, copper-based technology, applied in semiconductor/solid-state device manufacturing, circuits, electric solid-state devices, etc., can solve poor oxidation resistance, hardness and tensile properties, high hardness, unreliable welding, and poor device stability and other problems, to achieve the effect of improving oxidation resistance, easy control of shape, and stable welding

Active Publication Date: 2022-02-22
广东佳博电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the more commonly used bonding copper wire has lower cost than gold wire, and has better electrical and thermal conductivity. It has gradually replaced gold wire bonding materials. As research has found, copper wire has poor Oxidation resistance, high hardness, and tensile properties may lead to poor device stability, low work efficiency, and low bond yield. Therefore, in the prior art, trace element-doped Ways to improve the performance of bonding materials, using different trace elements to meet different performance requirements, there are methods of mixing metal grains and coatings, but often due to the degree of bonding between copper-based alloys and doped metals Poor problems, the bonding copper wire still has problems such as low oxidation resistance, high hardness and unreliable welding. With the market's demand for bonding materials such as high oxidation resistance, high purity, excellent bonding performance, and excellent ball forming The development of a low-cost, high-performance bonding copper wire material is particularly critical due to the increase in demand

Method used

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  • Copper-based bonding wire with nickel-plated surface and preparation method thereof
  • Copper-based bonding wire with nickel-plated surface and preparation method thereof
  • Copper-based bonding wire with nickel-plated surface and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for preparing a nickel-plated copper-based bonding wire, comprising the steps of:

[0031] 1) Raw material preparation and pretreatment: all metal raw materials are cleaned and dried by ultrasonic technology with absolute ethanol;

[0032] The metal copper accounts for 99.99%, the trace addition of manganese accounts for 0.002%, tungsten accounts for 0.004%, boron accounts for 0.002%, and zirconium accounts for 0.002%;

[0033] 2) Substrate melting and casting: Mix the dried metal raw materials, and conduct vacuum melting under the atmosphere of high-purity argon gas, the vacuum degree is 0.001MPa, the melting temperature is 1050°C, and the melting time is 50 minutes, and then orientation is carried out Continuous casting to obtain a copper-based master alloy wire with a diameter of 50 μm;

[0034] 3) Cold drawing: cooling the copper-based master alloy to 150°C, performing rough drawing to make the diameter 20 μm, and then performing fine drawing to make the d...

Embodiment 2

[0040] A method for preparing a nickel-plated copper-based bonding wire, comprising the steps of:

[0041] 1) Raw material preparation and pretreatment: all metal raw materials are cleaned and dried by ultrasonic technology with absolute ethanol;

[0042] The metal copper accounts for 99.993%, the trace addition of manganese accounts for 0.002%, tungsten accounts for 0.002%, boron accounts for 0.002%, and zirconium accounts for 0.001%;

[0043] 2) Substrate melting and casting: Mix the dried metal raw materials, and carry out vacuum melting under the atmosphere of high-purity argon gas, the vacuum degree is 0.005MPa, the melting temperature is 1150°C, and the melting time is 60 minutes, and then the orientation is carried out Continuous casting to obtain a copper-based master alloy wire with a diameter of 60 μm;

[0044] 3) Cold drawing: cooling the copper-based master alloy to 160°C, performing rough drawing to make the diameter 25 μm, and then performing fine drawing to mak...

Embodiment 3

[0050] A method for preparing a nickel-plated copper-based bonding wire, comprising the steps of:

[0051] 1) Raw material preparation and pretreatment: all metal raw materials are cleaned and dried by ultrasonic technology with absolute ethanol;

[0052] The metal copper accounts for 99.996%, the trace addition of manganese accounts for 0.001%, tungsten accounts for 0.001%, boron accounts for 0.001%, and zirconium accounts for 0.001%;

[0053] 2) Substrate melting and casting: Mix the dried metal raw materials, and carry out vacuum melting in the atmosphere of high-purity argon, the vacuum degree is 0.008MPa, the melting temperature is 1200°C, and the melting time is 70 minutes, and then the orientation is carried out Continuous casting to obtain a copper-based master alloy wire with a diameter of 60 μm;

[0054] 3) Cold drawing: cooling the copper-based master alloy to 170°C, performing rough drawing to make the diameter 25 μm, and then performing fine drawing to make the d...

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Abstract

The invention belongs to the technical field of copper-based bonding materials, and in particular relates to a nickel-plated copper-based bonding wire and a preparation method thereof. The raw material of the copper-based bonding wire includes metal copper, nickel, manganese, tungsten, boron and zirconium, and the metal copper, manganese, tungsten, boron and zirconium constitute a copper-based master alloy, and a nickel layer is plated on the surface of the copper-based master alloy The copper-based bonding wire is made; the oxidation resistance and bonding stability of the copper-based bonding wire are greatly improved by means of nickel plating on the surface, and the copper-based bonding wire doped with trace elements and the surface nickel plating can Effectively improve the performance of the bonding wire material, form uniform balls, and improve welding performance. In actual welding, the solder balls are easy to control and have excellent appearance, and the welding is relatively stable; the combination of alloy method and surface coating is used to improve bonding. The properties of the wire form a copper-based bonding wire with high hardness, high oxygen and sulfur resistance, high ductility, and good plasticity. Compared with the palladium plating process, the manufacturing cost is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of copper-based bonding materials, and in particular relates to a nickel-plated copper-based bonding wire and a preparation method thereof. Background technique [0002] The bonding material is a micro-connection technology that can be tightly bonded to the substrate pad through heat, pressure, and ultrasonic energy. As a key material for wire bonding, it plays the role of connecting semiconductor chips and pins, and transmitting current and signals. It occupies a leading position in the connection method by virtue of its simple process, low cost, and suitability for various packaging forms. It is currently mainly used in integrated circuits, semiconductor discrete devices, and LEDs. [0003] At present, the more commonly used bonding copper wire has lower cost than gold wire, and has better electrical and thermal conductivity. It has gradually replaced gold wire bonding materials. As research has found, cop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C25D3/12C22F1/08C22F1/02C22C9/00
CPCH01L24/45H01L24/43C22C9/00C22F1/02C22F1/08C25D3/12H01L2224/45147H01L2224/45565H01L2224/45655H01L2224/4321H01L2224/43825H01L2224/43848
Inventor 周钢
Owner 广东佳博电子科技有限公司
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