Low-thermal-conductivity thermal insulation material and preparation method thereof

Abstract

The invention discloses a low-thermal-conductivity thermal insulation material and a preparation method thereof. The low-thermal-conductivity thermal insulation material is prepared from the followingraw materials of, in parts by mass, 60 parts-70 parts of fumed silica; 10 parts-20 parts of common silica; 10 parts-15 parts of silicon carbide, and 5 parts-10 parts of fibers. The fumed silica and the common silica are combined for use, so that the characteristics of good thickening property and difficulty in moisture absorption of the fumed silica can be exerted, meanwhile, the characteristic of polyhydroxyl of the common silica can be exerted, the fumed silica can be better compounded with the fibers, and the moisture absorption characteristic can be inhibited due to the low content of thefumed silica; and the silicon carbide has radiation resistance and wear resistance, the silicon carbide is used as an intermediate substance in the thermal insulation material, and the fumed silica,the common silica and the fibers are filled in the silicon carbide, so that the silicon carbide has relatively high strength on the premise of ensuring a low heat conductivity coefficient.

Description

technical field [0001] The application relates to a heat insulating material with low thermal conductivity and a preparation method thereof. Background technique [0002] With the inevitable trend of energy saving and consumption reduction in the industrial field, the trend of using low thermal conductivity refractory products in industrial kilns and high temperature equipment is becoming more and more obvious. Traditional heat insulation refractory materials generally include ceramic fiberboard or calcium silicate Because its thermal insulation performance is difficult to meet the thermal insulation needs of places with strict requirements on thermal insulation space and thickness, that is, the coordination between thermal insulation thickness and thermal insulation capacity cannot be achieved, so nano-scale thermal insulation panels with ultra-low thermal conductivity came into being. pregnancy. The current molding process of nano heat insulation board materials is mostly...

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Problems solved by technology

[0002] With the inevitable trend of energy saving and consumption reduction in the industrial field, the trend of using low thermal conductivity refractory products in industrial kilns and high temperature equipment is becoming more and more obvious. Traditional heat insulation refractory materials generally include ceramic fiberboard or calcium silicate Because its thermal insulation performance is difficult to meet the thermal insulation needs of places with strict requirements on thermal insulation space and thickness, that is, the coordination between thermal insulation thickness and thermal insulation capacity cannot be achieved, so nano-scale thermal insulation panels with ultra-low thermal conductivity came into being. pregnancy

The current molding process of nano heat insulation board materials is mostly dry powder compression molding, but the products produced by it have low strength, large thickness deviation, and some will have the problem of delamination and falling off, and there are still high breakage rates during use. Inconvenient transportation and installation

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