Cyanide-free silver plating electroplating solution and preparation method

A cyanide-free silver plating and electroplating solution technology, applied in the field of electroplating technology, can solve the problems of wear resistance, poor corrosion resistance, rough coating, poor conductivity, etc., achieve good corrosion resistance, reduce pinholes in the coating, and good conductivity Effect

Active Publication Date: 2020-09-15
GUANGZHOU SANFU NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the coating formed by this electroplating solution is rough, poor in brightness, poor in wear resistance and corrosion resistance, and poor in conductivity.

Method used

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  • Cyanide-free silver plating electroplating solution and preparation method
  • Cyanide-free silver plating electroplating solution and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Among them, the reagents used in the present invention are commonly used reagents, which can be purchased from conventional reagent production and sales companies. Embodiment 1 A kind of copper plated piece that adopts cyanide-free silver-plating electroplating solution electroplating

[0031] Described cyanide-free silver plating electroplating solution, is made up of the component of following mass concentration:

[0032] Silver nitrate 30g / L, complexing agent 50g / L, sodium citrate 20g / L, potassium carbonate 5g / L, sodium lauryl sulfate 16g / L, disodium hydrogen phosphate 5g / L, brightener 5g / L, Ammonia water 15g / L.

[0033] The complexing agent is composed of aminoacetic acid, tryptophan and 2,2-bipyridine in a weight ratio of 5:4:3.

[0034] The brightener is composed of niacin and urea in a weight ratio of 8:3.

[0035] The preparation method of described cyanide-free silver plating electroplating solution, comprises the steps:

[0036] S1. Dissolve complexing age...

Embodiment 2

[0041] Clean the surface of the copper part, immerse it in the cyanide-free silver plating solution, use the copper plated part as the cathode, and the silver plate as the anode. After the silver plating is completed, take out the plated part from the electroplating solution, and clean the surface with distilled water. Cool air dry. The temperature during the electroplating is 20°C, and the current density is 0.5A / dm 2 , Plating time is 10min. Embodiment 2 A kind of copper plated piece that adopts cyanide-free silver-plating electroplating solution electroplating

[0042] Described cyanide-free silver plating electroplating solution, is made up of the component of following mass concentration:

[0043] Silver nitrate 35g / L, complexing agent 70g / L, sodium citrate 30g / L, potassium carbonate 14g / L, sodium lauryl sulfate 20g / L, disodium hydrogen phosphate 12g / L, brightener 20g / L, Potassium hydroxide 20g / L.

[0044] The complexing agent is composed of glycine, tryptophan and 2,...

Embodiment 3

[0052] Clean the surface of the copper part, immerse it in the cyanide-free silver plating solution, use the copper plated part as the cathode, and the silver plate as the anode. After the silver plating is completed, take out the plated part from the electroplating solution, and clean the surface with distilled water. Cool air dry. The temperature during the electroplating is 23°C, and the current density is 2.0A / dm 2 , Plating time is 10min. Embodiment 3 A kind of copper plated piece that adopts cyanide-free silver-plating electroplating solution electroplating

[0053] Described cyanide-free silver plating electroplating solution, is made up of the component of following mass concentration:

[0054] Silver nitrate 40g / L, complexing agent 100g / L, sodium citrate 40g / L, potassium carbonate 20g / L, sodium lauryl sulfate 25g / L, disodium hydrogen phosphate 18g / L, brightener 30g / L, Sodium hydroxide 25g / L.

[0055] The complexing agent is composed of aminoacetic acid, tryptophan...

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Abstract

The invention belongs to the technical field of electroplating technologies, and particularly relates to a cyanide-free silver plating electroplating solution and a preparation method. The cyanide-free silver plating electroplating solution is prepared from the following components in mass concentration: 30-40 g / L of silver nitrate, 50-100 g / L of a complexing agent, 20-40 g / L of sodium citrate, 5-20 g / L of potassium carbonate, 16-25 g / L of sodium lauryl sulfate, 5-18 g / L of disodium hydrogen phosphate, 5-30 g / L of a brightener, and 15-25 g / L of a pH conditioning agent. According to the cyanide-free silver plating electroplating solution, the stability is good, a silver thin film obtained through electrodeposition is good in binding force and bright in surface, the thin silver film is denseand uniform, and excellent in discoloration resistance and corrosion resistance, and can be applied to various fields such as decorative electroplating and functional electroplating.

Description

technical field [0001] The invention belongs to the technical field of electroplating technology, and in particular relates to a cyanide-free silver plating electroplating solution and a preparation method thereof. Background technique [0002] Silver is a silvery white, malleable, malleable and reflective precious metal with an atomic weight of 107.87 and a density of 10.5g / cm 3 , the melting point is 960.8°C, the hardness is 60-140Hv, and the conductivity is 63.3×10 at 25°C -4 Ω -1 cm -1 , has good electrical conductivity and weldability. Among all precious metal platings, silver plating is the most widely used and used in the largest amount, such as various jewelry, tableware, musical instruments, trophies, etc. Functional silver plating is mainly used in connectors, printed circuit boards, slip rings, waveguide devices, reeds, semiconductors, instrumentation, and air seals in rocket engine systems. Sulfur dioxide or hydrogen sulfide in the air tends to react slowly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46
CPCC25D3/46
Inventor 田志斌许荣国詹益腾
Owner GUANGZHOU SANFU NEW MATERIALS TECH
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