Selective doping method for N-type solar cell
A solar cell and selective technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of high doping concentration in lightly doped regions, no advantages and unevenness in heavily doped regions, and achieve low doping concentration and convenience. Process upgrade, shallow depth effect
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[0038] Example 1
[0039] A selective doping method for N-type solar cells uses boron slurry as the diffusion source in the heavily doped region, and uses a gas-phase boron source as the diffusion source in the lightly doped region; the method includes the following steps:
[0040] 1) N-type silicon wafer for texturing;
[0041] 2) Use a tube furnace for oxidation, set the oxidation temperature to 800°C, the oxidation time to 10min, and the oxygen flow rate to 1000sccm;
[0042] 3) Print boron paste on the texturing surface, set the drying temperature to 200℃ and the drying time to 1min;
[0043] 4) Use an automated robotic arm to insert the film, with the printing side facing out, back-to-back; the diffusion process is as follows: ①oxidation, temperature 850℃, oxygen flow setting 1000sccm, hold for 5min; ②The furnace tube is heated to 980℃ first, and the atmosphere is large Nitrogen 18000sccm, hold for 30min; ③Cool down to 860℃, atmosphere of large nitrogen 18000sccm, small oxygen 60s...
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[0045] Example 2
[0046] A selective doping method for N-type solar cells uses boron slurry as the diffusion source in the heavily doped region, and uses a gas-phase boron source as the diffusion source in the lightly doped region; the method includes the following steps:
[0047] 1) N-type silicon wafer for texturing;
[0048] 2) Use a tube furnace for oxidation, set the oxidation temperature to 900℃, oxidation time to 10min, and oxygen flow rate to 2000sccm;
[0049] 3) Print boron paste on the texturing surface, set the drying temperature to 200℃ and the drying time to 1min;
[0050] 4) Use an automated mechanical arm to insert the film, with the printing side facing out and back to back; the diffusion process is as follows: ①oxidation, the temperature is 900℃, the oxygen flow is set to 2000sccm, and it is maintained for 5min; Nitrogen 18000sccm, hold for 40min; ③Cool down to 900℃, atmosphere of large nitrogen 18000sccm, small oxygen 60sccm, small nitrogen 200sccm, hold for 15min; ...
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