Uniform droplet/polymer space circuit combined printing device and method

Abstract

The invention discloses a uniform droplet / polymer space circuit combined printing device and method, and belongs to the field of three-dimensional circuit rapid printing. The device comprises an anti-oxidation inert gas cylinder, a pressure reducing valve, a glove box, an oxygen content detector, a water content detector, a high-molecular polymer printing assembly, a uniform metal droplet sprayingassembly, a signal generator, a laser, a temperature controller, a motion control card, a three-dimensional moving platform and a hot bed; the anti-oxidation inert gas cylinder is in communication with the glove box through the pressure reducing valve, the three-dimensional moving platform is fixed to the bottom face of an inner cabin of the glove box, and the hot bed is fixed to the upper surface of the three-dimensional moving platform; the high-molecular polymer printing assembly, the uniform metal droplet spraying assembly and the laser are all fixed to the top of the inner cabin of the glove box through cantilever beams, and the laser remelts a metal circuit deposited and solidified on the hot bed after receiving a control signal. According to the uniform droplet / polymer space circuit combined printing device and the method, the problems that air is prone to remaining and pores are easy to form when the silver paste is used for circuit printing are solved, so that the circuit forming quality and the conductivity can be improved.

Description

technical field [0001] The invention belongs to the field of rapid printing of three-dimensional circuits, and in particular relates to a uniform droplet / polymer space circuit combined printing device and method. Background technique [0002] With the advancement of electronic circuit design and manufacturing technology, circuit manufacturing is developing towards large-scale, digital, and personalized directions. In order to further reduce product size, increase circuit integration density and wiring freedom, three-dimensional circuits are widely used in circuit design and manufacturing. middle. With the rise of 3D printing technology in recent years, it has become possible to combine layer-by-layer deposition manufacturing technology with electronic circuit manufacturing technology and realize digitization. Conduct electrical interconnections, and parts can be printed in arbitrary shapes and mounted on other objects. 3D printing technology can break through the limitatio...

AI Technical Summary

Problems solved by technology

This process can achieve a higher degree of freedom in the wiring of the circuit in three dimensions, and has advantages in printing low-frequency space circuits, but it is difficult to apply to high-frequency space circuit printing that requires high line quality.

Because the silver paste itself tends to retain air and form pores, and the 3D printing process itself has a step effect that will lead to poor smoothness and conductivity of the formed circuit, so it cannot be used for high-frequency circuit printing

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