A kind of composite nano conductive filler and its preparation and application
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A nano-conductive and composite material technology, applied in nanotechnology, nanotechnology, conductive adhesives and other directions, can solve the problems of poor conductivity and stability of conductive silver glue, and achieve improved conductivity, stability and good dispersion. Effect
Active Publication Date: 2022-03-01
CISDI RES & DEV CO LTD
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[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a composite nano-conductive filler and its preparation and application, which are used to solve the problems of poor conductivity and stability of the conductive silver glue in the prior art.
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[0040] The preparation method of composite nano conductive filler of the present invention comprises the steps:
[0041] (1) Take glucose, silver oxide powder and nitrogen source according to molar concentration ratio 5: (0.1~3): 2 ratio;
[0042] (2) Mix and grind glucose and silver oxide powder in an agate mortar, then add nitrogen source for secondary mixing and grinding;
[0043] (3) Transfer the grinding mixture to a quartz crucible and place it in a high-temperature furnace;
[0044] (4) Adjust heating and heat preservation procedures, heat to 700°C or above under an inert gas protection atmosphere, and calcinate for 1-2 hours;
[0045] (5) Take the quartz crucible out of the high-temperature furnace and cool it to room temperature, take out the material in the quartz crucible, grind it, and sieve it through a 50*50 μm sieve to obtain the composite nano-conductive filler.
[0046] In the preparation method of the composite nano conductive filler of the present invention,...
Embodiment 1
[0050] According to the molar ratio of 5:0.1:2, 1.8g of glucose, 0.0462g of silver oxide powder and 0.36g of ammonium carbonate were weighed, mixed and ground, and calcined in a high-temperature furnace at 700°C for 1h.
Embodiment 2
[0052] According to the molar ratio of 5:1:2, 1.8g of glucose, 0.462g of silver oxide powder and 0.36g of ammonium carbonate were weighed, mixed and ground, and calcined in a high-temperature furnace at 700°C for 1h.
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Abstract
The invention belongs to the technical field of conductive materials, and specifically discloses a novel composite nano conductive filler and its preparation and application. The composite nano-conductive filler is a nano-silver composite material formed of nano-silver particles and porous graphite carbon, which is a porous foam-like structure; the conductive filler is physically ground and mixed in sequence with glucose, silver oxide powder and nitrogen source, and then heated at a high temperature. Calcined in the molten state obtained. The nano-silver composite material prepared by the present invention has good dispersion, high stability, and excellent electrical conductivity. It can replace conventional conductive filler silver powder, and it can be formulated into conductive silver glue with specific resin, curing agent and auxiliary agent in proportion, which can effectively improve The movement rate of electrons inside the conductive silver glue reduces the resistivity, thereby improving the conductive effect of the conductive silver glue. The invention provides a novel conductive material with excellent performance for the fields of sensors, electronic devices, circuit board transfer welding and the like.
Description
technical field [0001] The invention relates to the technical field of conductive materials, in particular to a composite nano conductive filler and its preparation and application. Background technique [0002] As a substitute for traditional tin-lead solder, conductive silver paste is widely used in electronic industries such as IC packaging, LED packaging and MEMS sensor packaging. Conductive silver glue has many advantages: (1) green and environmental protection, does not contain lead and other substances harmful to the human body and the environment, and the use process is simple, no pre-cleaning and post-welding cleaning, no secondary pollution; (2) the process conditions are mild, There is no need for the soldering temperature of tin-lead solder paste to be above 200°C, and only 80°C to 180°C can complete the curing of the conductive silver glue. For heat-sensitive devices, conductive silver glue can minimize thermal stress and thermal damage; (3) high line resolutio...
Claims
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