Silicon-based micro-cavity narrow-band near-infrared photoelectric detector
A near-infrared optical and electrical detector technology, which is applied to circuits, electrical components, semiconductor devices, etc., can solve the problems of high cost, complicated detector preparation methods, and difficult integration of electronic devices, etc., and achieve low cost, high-efficiency detection, and response fast effect
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Embodiment 1
[0025] Such as figure 1 As shown, the silicon-based microcavity narrow-band near-infrared photodetector of this embodiment uses a single crystal silicon substrate 2 as a base, and the upper surface of the single crystal silicon substrate 2 is etched into a silicon microhole array structure. An upper insulating layer 1 is provided on the hole array; a layer of graphene film 3 is transferred on the lower surface of the single crystal silicon substrate 2 to form a graphene-silicon Schottky heterojunction; a lower surface is provided on the lower surface of the graphene film 3 An insulating layer 4; a metal reflective layer 5 is provided on the lower surface of the lower insulating layer 4;
[0026] Top electrode 6 is arranged on the upper surface of monocrystalline silicon substrate 2, and bottom electrode 7 is arranged on the lower surface of graphene film 3, and top electrode 6 forms ohmic contact with monocrystalline silicon substrate 2, and bottom electrode 7 and graphene Th...
Embodiment 2
[0041] Such as figure 1 As shown, the silicon-based microcavity narrow-band near-infrared photodetector of this embodiment uses a single crystal silicon substrate 2 as a base, and the upper surface of the single crystal silicon substrate 2 is etched into a silicon microhole array structure. An upper insulating layer 1 is provided on the hole array; a layer of graphene film 3 is transferred on the lower surface of the single crystal silicon substrate 2 to form a graphene-silicon Schottky heterojunction; a lower surface is provided on the lower surface of the graphene film 3 An insulating layer 4; a metal reflective layer 5 is provided on the lower surface of the lower insulating layer 4;
[0042] Top electrode 6 is arranged on the upper surface of monocrystalline silicon substrate 2, and bottom electrode 7 is arranged on the lower surface of graphene film 3, and top electrode 6 forms ohmic contact with monocrystalline silicon substrate 2, and bottom electrode 7 and graphene Th...
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