Production method of flexible circuit board, produced flexible circuit board and application of flexible circuit board
A technology for flexible circuit boards and preparation steps, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit coatings, etc., can solve problems such as restricting development, and achieve the effects of reducing disconnection, good compactness, and inhibiting electromigration.
Inactive Publication Date: 2021-01-15
廖斌 +1
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Problems solved by technology
At present, the production technology of ultra-thin, high-density, high-integrated high-end flexible circuit boards is still in the hands of foreign giants, and the bottleneck technology of high-end copper-clad laminate production of integrated circuits for 5G and other high-end applications has seriously restricted my country's development of integrated circuit flexible circuits. Developments in the field of packaging
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Embodiment 1
[0031] To prepare PI polymer flexible copper clad laminate, follow the steps below:
[0032] (1) Prepare the first hybrid layer, and deposit it on the surface of PI polymer through a high-energy ion beam system to obtain a hybrid layer of polymer and metal ions; the ion beam energy is 12keV, and the treatment dose is 1*10 18 ions / cm 2 , vacuum degree 5*10 -3 Pa, the target is Ag target, the thickness is 100nm;
[0033] (2) Prepare an oxide layer, prepare an insulating oxide by vapor deposition in the first hybrid layer, SiO2 as an evaporation source, and the working pressure of the vacuum chamber is 5.0×10 －3 Pa, the substrate temperature is 150°C, the power is 20kW, and the oxide thickness is 100nm;
[0034] (3) Prepare the second hybrid layer, deposit a high-energy ion beam on the surface of the first oxide layer to obtain a hybrid layer of polymer and metal ions, the ion beam energy is 12keV, and the treatment dose is 1*10 18 ions / cm 2 , vacuum degree 5*10 -3 Pa, the ...
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Abstract
The invention belongs to the field of preparation of 5G electronic materials, and particularly relates to a production method of a flexible circuit board, the produced flexible circuit board and an application of the flexible circuit board. The production method comprises the following steps: (1) performing high-energy ion beam deposition on the surface of a polymer to obtain a first hybrid layer;(2) obtaining an oxide layer on the surface of the first hybrid layer through vapor deposition; (3) performing high-energy ion beam deposition on the surface of the oxide layer to obtain a second hybrid layer; and (4) performing low-energy ion beam deposition on the surface of the second hybrid layer to obtain a metal layer. The hybrid layer is formed by using high-energy ion beams so that a problem of a binding force between a polymer and an oxide and between the oxide and a metal layer is effectively solved. The produced circuit board is low in roughness, good in compactness and few in defect, and phenomena of line breaking, whisker growth and the like in an electromigration process are reduced.
Description
technical field [0001] The invention belongs to the field of 5G electronic material preparation, and in particular relates to a method for preparing a flexible circuit board, the prepared flexible circuit board and the application of the flexible circuit board. Background technique [0002] 5G communication puts forward urgent requirements for circuit boards in terms of high frequency, low transmission loss, high density, and high integration. MPI high-frequency flexible copper-clad laminates are mainly used in FPC antenna boards for high-frequency signal transmission, and terminals are used in 5G mobile phones, Internet of Things, smart homes, unmanned driving, VR technology, etc. Flexible copper clad laminate (FCCL) is the substrate of flexible circuit board (FPC), and the existing single-sided or double-sided adhesive-free FCCL is mainly prepared by coating method, pressing method and sputtering method. The pressing method improves the bonding force between the copper fo...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0091H05K2203/1338
Inventor 廖斌陈琳王国梁罗军庞盼
Owner 廖斌