Production method of flexible circuit board, produced flexible circuit board and application of flexible circuit board
A technology for flexible circuit boards and preparation steps, applied in the directions of printed circuit manufacturing, printed circuits, printed circuit coatings, etc., can solve problems such as restricting development, and achieve the effects of reducing disconnection, good compactness, and inhibiting electromigration.
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[0030]Example 1
[0031]To prepare PI polymer flexible copper clad laminate, follow the steps below:
[0032](1) Prepare the first hybrid layer and deposit it on the PI polymer surface through a high-energy ion beam system to obtain a hybrid layer of polymer and metal ions; the ion beam energy is 12keV, and the treatment dose is 1*1018ions / cm2, Vacuum degree 5*10-3Pa, the target material is Ag target material, the thickness is 100nm;
[0033](2) Prepare the oxide layer, prepare insulating oxide by vapor deposition in the first hybrid layer, use SiO2 as the evaporation source, and the working pressure of the vacuum chamber is 5.0×10-3Pa, substrate temperature is 150℃, power is 20kW, oxide thickness is 100nm;
[0034](3) Prepare the second hybrid layer and deposit it on the surface of the first oxide layer by a high-energy ion beam to obtain a hybrid layer of polymer and metal ions. The ion beam energy is 12keV and the treatment dose is 1*10.18ions / cm2, Vacuum degree 5*10-3Pa, the target material...
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