A method for room temperature growth and post-processing of high-mobility oxide semiconductor thin films on flexible substrates
A technology for oxide semiconductors and flexible substrates, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as constraints, low mobility, etc., to repair film defects, improve flatness, high quality and performance Effect
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Embodiment 1
[0026] ZnO semiconductor thin film is grown at room temperature by magnetron sputtering method, and the substrate used is PET substrate, with N 2 O-O 2 The mixed gas is the working atmosphere, the total pressure of the atmosphere is 2Pa, N 2 O:O 2 The partial pressure ratio is 1:9. The follow-up treatment scheme of the ZnO film grown at room temperature is as follows: the first step, Ar plasma treatment, Ar pressure 5Pa, power 70W, Ar plasma bombardment film for 12min; the second step, pulse laser treatment, N 2 Working atmosphere, laser power 5mJ / cm 2 , the irradiation time to the film is 25ns, and the number of pulses is 1 time; the third step, O 2 Plasma treatment, O 2 Air pressure 7Pa, power 15W, O 2 Plasma bombarded the film for 40 minutes; the fourth step, UV light treatment, 254nm UV light, power 300mW / cm 2 , the film irradiation time 25min.
[0027] The ZnO semiconductor film prepared by the above method was subjected to the Hall test, and the results showed th...
Embodiment 2
[0029] SnO 2 The semiconductor thin film is grown at room temperature by electron beam evaporation, and the substrate used is a PET substrate, with N 2 O-O 2 The mixed gas is the working atmosphere, the total pressure of the atmosphere is 3Pa, N 2 O:O 2 The partial pressure ratio is 1:9. SnO grown at room temperature 2 The follow-up treatment plan of the film is as follows: the first step, Ar plasma treatment, Ar pressure 7Pa, power 80W, Ar plasma bombardment film for 15min; the second step, pulse laser treatment, N 2 Working atmosphere, laser power 8mJ / cm 2 , the irradiation time to the film is 27ns, and the number of pulses is 1 time; the third step, O 2 Plasma treatment, O 2 Air pressure 9Pa, power 18W, O 2 Plasma bombarded the film for 45 minutes; the fourth step, UV light treatment, 254nm UV light, power 400mW / cm 2 , The irradiation time of the film is 27min.
[0030] The SnO prepared by the above method 2 Semiconductor thin film, Hall test, the result shows th...
Embodiment 3
[0032] In 2 o 3 The semiconductor film is grown at room temperature by pulsed laser deposition method, and the substrate used is PC substrate, with N 2 O-O 2 The mixed gas is the working atmosphere, the total pressure of the atmosphere is 3Pa, N 2 O:O 2 The partial pressure ratio is 1:9. In grown at room temperature 2 o 3 The follow-up treatment plan of the film is as follows: the first step, Ar plasma treatment, Ar pressure 5Pa, power 75W, Ar plasma bombardment film for 12min; the second step, pulse laser treatment, N 2 Working atmosphere, laser power 7mJ / cm 2 , the irradiation time to the film is 25ns, and the number of pulses is 1 time; the third step, O 2 Plasma treatment, O 2 Air pressure 7Pa, power 15W, O 2 Plasma bombarded the film for 40 minutes; the fourth step, ultraviolet light treatment, 254nm ultraviolet light, power 350mW / cm 2 , The irradiation time of the film is 27min.
[0033] In prepared by the above method 2 o 3 Semiconductor film, Hall test, t...
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