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Electrostatic spinning metal fiber-copper composite high-temperature conductive film layer and preparation method thereof

A technology of metal fiber and conductive film layer, which is applied in the fields of fiber chemical characteristics, textiles and papermaking, sustainable manufacturing/processing, etc., and can solve problems such as clogging the screen, micro cracks and holes on the surface of the film layer, and the screen is not suitable for drying, etc.

Active Publication Date: 2021-02-02
深圳市永达辉光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the unavoidable volatility of traditional organic carriers has a direct impact on the quality of the electronic paste film. If the viscosity of the paste increases too quickly, it will easily cause blockage of the screen; if a large amount of volatilization is concentrated, it will easily cause microcracks on the surface of the film after drying and sintering. and holes and other defects; volatilization is too slow, it is not suitable for drying after screen printing, resulting in defects after sintering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Prepare metal ion solution,

[0040] Dissolve 3 grams of PVP and 3 grams of silver nitrate in 10ml of DMF in turn. Each component needs to be stirred evenly until it is fully dissolved before adding another component. After mixing well, stir at room temperature for another 10 h until the solution is clear without bubbles.

[0041] Step 2: Preparation of Spinning Precursor Solution

[0042] Take 6 grams of copper nitrate particles, take the above-mentioned metal ion solution, add together in 10ml of a mixed solvent of absolute ethanol and deionized water, stir at room temperature for 30min, then add 0.1 gram, while adding 30 grams of additives, the ratio of organic carrier terpineol, thickener (ethyl cellulose) and surfactant in the additives is 8:6:3. After electromagnetic stirring, the rotating speed of the electromagnetic stirrer is 1200 rpm and stirring at room temperature for 12 hours to obtain the spinning precursor solution.

[0043] Step 3: Preparation...

Embodiment 2

[0050] Step 1: Prepare metal ion solution,

[0051] Dissolve 6 grams of PVP and 3 grams of silver nitrate in 20ml of DMF in turn. Each component needs to be stirred evenly until it is fully dissolved before adding another component. After mixing well, stir at room temperature for another 11 h until the solution is clear and free of bubbles.

[0052] Step 2: Prepare spinning precursor solution,

[0053] Weigh 6 grams of copper nitrate particles and the above metal ion solution, add it to 20ml of a mixed solvent of absolute ethanol and deionized water, stir at room temperature for 30min, add glass powder with a binder particle size of 3um, and add 25 grams of additives, the ratio of organic carrier ethyl acetate, thickener (ethyl cellulose) and surfactant in the additives is 8:6:3. Afterwards, the spinning precursor solution was obtained by electromagnetic stirring at room temperature for 12 hours at the rotating speed of the electromagnetic stirrer at 1600 rpm.

[0054] Step...

Embodiment 3

[0061] Step 1: Prepare metal ion solution

[0062] Dissolve 10 grams of PVP and 6 grams of silver nitrate in 20ml of DMF in sequence. Each component must be stirred evenly until it is fully dissolved before adding another component. The mixed solution was stirred at room temperature for another 15 h until the solution was clear without bubbles.

[0063] Step 2: Preparation of Spinning Precursor Solution

[0064] Weigh 10 grams of copper nitrate particles, take the above metal ion solution, add it to 20ml of a mixed solvent of absolute ethanol and deionized water, stir at room temperature for 30min, add 0.2 gram, add 10 grams of additives simultaneously, organic carrier terpineol in the additives, thickener (ethyl cellulose), surfactant ratio are 8:6:3; Stir at room temperature for 12 hours at a rotational speed of 800 rpm to obtain a spinning precursor solution.

[0065] Step 3: Preparation of spun fibers,

[0066] Fill the spinning precursor solution into the syringe of t...

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PUM

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Abstract

The invention discloses an electrostatic spinning metal fiber-copper composite high-temperature conductive film layer, the component content in each mass volume unit being as follows: 1-10 g of PVP, 1-6 g of silver nitrate, 10-30 ml of DMF, 10-30 ml of a mixed solvent of absolute ethyl alcohol and deionized water, 1-10 g of copper nitrate, 0.1-0.2 g of glass powder and 10-30 g of an auxiliary. Theinvention also discloses a preparation method of the electrostatic spinning metal fiber-copper composite high-temperature conductive film layer. The preparation method comprises the following steps:1, preparing a metal ion solution; 2, preparing a spinning precursor solution; 3, preparing spinning fibers; 4, reducing to obtain conductive fibers; and 5, carrying out sintering treatment. The product provided by the invention effectively improves the conductivity of inner core copper powder particles, and the preparation method provided by the invention is simplified in production process and reduced in production cost.

Description

technical field [0001] The invention belongs to the technical field of high-temperature conductive film layers, and relates to an electrospun metal fiber-copper composite high-temperature conductive film layer, and also relates to a preparation method of the electrospun metal fiber-copper composite high-temperature conductive film layer. Background technique [0002] With the improvement of electrical conductivity and heat transfer efficiency requirements of electronic components in the fields of materials, chemical industry and microelectronics, traditional materials are difficult to meet the needs of technological development. Therefore, it is necessary to develop materials with excellent electrical conductivity, high thermal conductivity and good stability. new material. [0003] Metal composite nanofibers have important application prospects in many fields of material science due to their excellent optical, electrical, and catalytic properties. Among the many methods fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D04H1/728D04H1/4382D04H1/4234D01F9/10
CPCD04H1/728D04H1/4382D04H1/4234D01F9/10Y02P20/10
Inventor 屈银虎王钰凡高浩斐张红何炫张学硕
Owner 深圳市永达辉光电有限公司