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Low-profile electrolytic copper foil for high-density interconnected circuit board

A technology of electrolytic copper foil and low profile, applied in the field of copper foil, can solve the problems of not being able to meet the requirements of high-density interconnected circuit boards, adverse effects on circuit quality and reliability, and not being able to meet thin line width and line spacing, etc., and achieve significant market competitiveness , Excellent tensile strength at room temperature, and wide applicability to the environment

Active Publication Date: 2021-03-09
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional ordinary copper foil in the current copper foil substrate cannot meet the requirements of high-density interconnected circuit boards, and cannot meet the performance of thin line width and small line spacing, and cannot carry large currents.
At the same time, due to the problems of excessive roughness and low elongation at high temperature of traditional copper foil, it is easy to cause signal short circuit due to the conduction of the two pieces of copper on the core board and thermal expansion and cooling of the film during high temperature and high pressure lamination process. The thermal cracking of the copper foil caused by shrinkage will have a negative impact on the quality and reliability of the subsequent circuits.

Method used

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  • Low-profile electrolytic copper foil for high-density interconnected circuit board

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preparation example Construction

[0047] In one embodiment, the preparation method of the copper foil layer comprises the following steps:

[0048] (1) Configure the electrolyte: mix the copper salt, inorganic acid, chloride salt and leveling agent in the electrolyte evenly at 40-60°C, and place it in the electrolytic cell;

[0049] (2) Electrochemical reaction: through direct current, at a current density of 40-80A / dm 2 Under these conditions, copper foil is precipitated at the cathode and peeled off.

[0050] In a preferred embodiment, the preparation method of the copper foil layer comprises the following steps:

[0051] (1) Configure the electrolyte: mix the copper salt, inorganic acid, chloride salt and leveling agent in the electrolyte evenly at 50°C, and place it in the electrolytic cell;

[0052] (2) Electrochemical reaction: through direct current, at a current density of 70A / dm 2 Under these conditions, copper foil is precipitated at the cathode and peeled off.

[0053] Coarsening layer

[005...

Embodiment 1

[0102] Embodiment 1 of the present invention provides a low-profile electrolytic copper foil for a high-density interconnection circuit board, which comprises a copper foil layer, a roughening layer, a protective barrier layer, a passivation layer, and a silane coupling agent layer in sequence.

[0103] The copper foil layer is obtained by electrolysis in an electrolyte solution containing copper ions; the electrolyte solution is 250g / L copper salt, 70g / L inorganic acid, 10mg / L chloride salt, and 1.5mg / L leveler.

[0104] The copper salt is copper sulfate pentahydrate; the inorganic acid is sulfuric acid; the chloride salt is hydrochloric acid; the leveling agent is nonionic cellulose ether and leveling agent-1; the leveling agent-1 Contains amino and carboxyl groups, weight average molecular weight is 50000-60000, CAS: 9000-70-8, purchased from Rock Chemicals; the non-ionic cellulose ether contains methoxy and hydroxyethyl groups, and the methoxy content is 22- 30wt%, the sub...

Embodiment 2

[0124] Embodiment 2 of the present invention provides a low-profile electrolytic copper foil for high-density interconnected circuit boards, which comprises a copper foil layer, a roughening layer, a protective barrier layer, a passivation layer, and a silane coupling agent layer in sequence.

[0125] The copper foil layer is obtained by electrolysis in an electrolyte solution containing copper ions; the electrolyte solution is 350g / L copper salt, 150g / L inorganic acid, 80mg / L chloride salt, and 45mg / L leveler.

[0126] The copper salt is copper sulfate pentahydrate; the inorganic acid is sulfuric acid; the chloride salt is hydrochloric acid; the leveling agent is nonionic cellulose ether and leveling agent-1; the leveling agent-1 Contains amino and carboxyl groups, weight average molecular weight is 50000-60000, CAS: 9000-70-8, purchased from Rock Chemicals; the non-ionic cellulose ether contains methoxy and hydroxyethyl groups, and the methoxy content is 22- 30wt%, the subst...

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Abstract

The invention relates to the field of copper foils, and particularly relates to a low-profile electrolytic copper foil for a high-density interconnected circuit board. The electrolytic copper foil sequentially comprises a copper foil layer, a roughening treatment layer, a protective barrier layer, a passivation layer and a silane coupling agent layer, wherein the thickness of the copper foil layeris 6-35 [mu]m, the weight per unit area is 50-30 g / m<2>, the weight deviation per unit area is less than 5%, the tensile strength is not less than 350 N / mm<2> at the temperature of 25 DEG C, , the elongation is not less than 4% at the temperature of 25 DEG C, the peel strength is not less than 0.7 kg / cm, the smooth surface Ra is not more than 0.43 [mu]m, and the rough surface Rz is not more than3.5 [mu]m. The electrolytic copper foil provided by the invention is simple in raw material, non-toxic, harmless, safe and environment-friendly, has excellent normal-temperature tensile strength and high-temperature tensile strength, can tolerate the high temperature of 200 DEG C, can meet better flatness and low profile tolerance, is simple to operate, can completely meet the requirements of themarket on the electrolytic copper foil for the high-density interconnected circuit board, is high in additional value, and wide in environment applicability, and has the obvious market competitiveness.

Description

technical field [0001] The invention relates to the field of copper foil, and more specifically, the invention relates to a low-profile electrolytic copper foil for high-density interconnected circuit boards. Background technique [0002] Copper With the development of electronic products in the direction of light, thin, small, wearable and multi-functional, new requirements are constantly put forward for copper foil for multi-layer circuit boards. There are higher requirements for surface roughness, dimensional stability, heat resistance, high-frequency and high-speed characteristics, and fine line processing, which continuously promote the development of copper foil for circuit boards. [0003] Copper Clad Laminate (CCL) is the main component of the circuit board. It is made of insulating film and two upper and lower copper foils, then hot-pressed, and then etched to form the required circuit, which is the core board of the circuit board. . However, the traditional ordin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09C25D1/04C25D3/38C25D7/06
CPCH05K1/09C25D1/04C25D3/38C25D7/0614H05K2201/0355H05K3/022H05K3/389H05K2201/0338C25D5/12C25D5/10C25D9/08C25D3/562C25F3/02
Inventor 王俊锋廖平元郭志航钟孟捷刘少华王崇华庄伟雄温丙台刘焕添叶冬萌姚国欢王洪杰
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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