The invention relates to the field of
copper foils, and particularly relates to a low-profile electrolytic
copper foil for a high-density interconnected circuit board. The electrolytic
copper foil sequentially comprises a
copper foil layer, a roughening treatment layer, a
protective barrier layer, a
passivation layer and a
silane coupling agent layer, wherein the thickness of the
copper foil layeris 6-35 [mu]m, the weight per unit area is 50-30 g / m<2>, the weight deviation per unit area is less than 5%, the tensile strength is not less than 350 N / mm<2> at the temperature of 25 DEG C, , the elongation is not less than 4% at the temperature of 25 DEG C, the peel strength is not less than 0.7 kg / cm, the
smooth surface Ra is not more than 0.43 [mu]m, and the
rough surface Rz is not more than3.5 [mu]m. The electrolytic
copper foil provided by the invention is simple in
raw material, non-toxic, harmless, safe and environment-friendly, has excellent normal-temperature tensile strength and high-temperature tensile strength, can tolerate the high temperature of 200 DEG C, can meet better flatness and low profile tolerance, is simple to operate, can completely meet the requirements of themarket on the electrolytic copper foil for the high-density interconnected circuit board, is high in additional value, and wide in environment applicability, and has the obvious market competitiveness.