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A low-profile electrolytic copper foil for high-density interconnect circuit boards

An electrolytic copper foil, low profile technology, applied in the field of copper foil, can solve the problems of inability to meet the requirements of high-density interconnected circuit boards, adverse effects on circuit quality reliability, inability to meet fine line width and line spacing, etc., and achieve significant market competitiveness. , Excellent normal temperature tensile strength, wide applicability to the environment

Active Publication Date: 2022-08-05
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional ordinary copper foil in the current copper foil substrate cannot meet the requirements of high-density interconnected circuit boards, and cannot meet the performance of thin line width and small line spacing, and cannot carry large currents.
At the same time, due to the problems of excessive roughness and low elongation at high temperature of traditional copper foil, it is easy to cause signal short circuit due to the conduction of the two pieces of copper on the core board and thermal expansion and cooling of the film during high temperature and high pressure lamination process. The thermal cracking of the copper foil caused by shrinkage will have a negative impact on the quality and reliability of the subsequent circuits.

Method used

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  • A low-profile electrolytic copper foil for high-density interconnect circuit boards

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preparation example Construction

[0047] In one embodiment, the preparation method of the copper foil layer includes the following steps:

[0048] (1) Configure the electrolyte: Mix the copper salt, inorganic acid, chloride salt and leveling agent in the electrolyte evenly at 40-60°C and place it in the electrolytic cell;

[0049] (2) Electrochemical reaction: direct current, the current density is 40-80A / dm 2 Under the conditions, the copper foil is precipitated at the cathode and peeled off, that is, it is obtained.

[0050] In a preferred embodiment, the preparation method of the copper foil layer includes the following steps:

[0051] (1) Configure the electrolyte: mix the copper salt, inorganic acid, chloride salt and leveling agent in the electrolyte evenly at 50°C and place it in the electrolytic cell;

[0052] (2) Electrochemical reaction: direct current, at a current density of 70A / dm 2 Under the conditions, the copper foil is precipitated at the cathode and peeled off, that is, it is obtained.

...

Embodiment 1

[0102] Embodiment 1 of the present invention provides a low-profile electrolytic copper foil for a high-density interconnected circuit board, which sequentially includes a copper foil layer, a roughening treatment layer, a protective barrier layer, a passivation layer, and a silane coupling agent layer.

[0103] The copper foil layer is obtained by electrolysis in an electrolyte solution containing copper ions; the electrolyte solution is 250g / L copper salt, 70g / L inorganic acid, 10mg / L chloride salt, and 1.5mg / L leveling agent.

[0104] The copper salt is copper sulfate pentahydrate; the inorganic acid is sulfuric acid; the chloride salt is hydrochloric acid; the leveling agent is nonionic cellulose ether and leveling agent-1; the leveling agent-1 Contains amino and carboxyl groups, weight average molecular weight is 50000-60000, CAS: 9000-70-8, purchased from Rock Chemical; the non-ionic cellulose ether contains methoxy and hydroxyethyl, and the methoxy content is 22- 30wt%,...

Embodiment 2

[0124] Embodiment 2 of the present invention provides a low-profile electrolytic copper foil for a high-density interconnected circuit board, which sequentially includes a copper foil layer, a roughening treatment layer, a protective barrier layer, a passivation layer, and a silane coupling agent layer.

[0125] The copper foil layer is obtained by electrolysis in an electrolyte solution containing copper ions; the electrolyte solution is 350g / L copper salt, 150g / L inorganic acid, 80mg / L chloride salt, and 45mg / L leveling agent.

[0126] The copper salt is copper sulfate pentahydrate; the inorganic acid is sulfuric acid; the chloride salt is hydrochloric acid; the leveling agent is nonionic cellulose ether and leveling agent-1; the leveling agent-1 Contains amino and carboxyl groups, weight average molecular weight is 50000-60000, CAS: 9000-70-8, purchased from Rock Chemical; the non-ionic cellulose ether contains methoxy and hydroxyethyl, and the methoxy content is 22- 30wt%,...

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Abstract

The present invention relates to the field of copper foil, and more particularly, the present invention relates to a low-profile electrolytic copper foil for high-density interconnected circuit boards. The electrolytic copper foil sequentially includes a copper foil layer, a roughening treatment layer, a protective barrier layer, and a passivation layer. , silane coupling agent layer; the thickness of the copper foil layer is 6-35μm, and the weight per unit area is 50-305g / m 2 , the weight deviation per unit area is less than 5%, and the tensile strength at 25°C is ≥350N / mm 2 , the elongation at 25°C is ≥4%, the peel strength is ≥0.7kg / cm, the smooth surface Ra≤0.43μm, and the rough surface Rz≤3.5μm. The electrolytic copper foil provided by the invention is simple in raw material, non-toxic and harmless, safe and environmentally friendly, has excellent normal temperature tensile strength and high temperature tensile strength, can withstand high temperature of 200 DEG C, and can meet the requirements of better flatness and low profile. It has high added value, wide environmental applicability, and has significant market competitiveness.

Description

technical field [0001] The present invention relates to the field of copper foils, and more particularly, to a low-profile electrolytic copper foil for high-density interconnection circuit boards. Background technique [0002] With the development of electronic products in the direction of light, thin, small, wearable, and multi-functional, new requirements are constantly being put forward for copper foil for multi-layer circuit boards. There are higher requirements for surface roughness, dimensional stability, heat resistance, high-frequency and high-speed characteristics, and thin circuit processing, which continuously promotes the development of copper foil for circuit boards. [0003] Copper Clad Laminate (CCL) is the main component in the circuit board. It is made of insulating film and two upper and lower copper foils after lamination and hot pressing, and then etching to form the required lines, which is the core board of the circuit board. . However, the traditiona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09C25D1/04C25D3/38C25D7/06
CPCH05K1/09C25D1/04C25D3/38C25D7/0614H05K2201/0355H05K3/022H05K3/389H05K2201/0338C25D5/12C25D5/10C25D9/08C25D3/562C25F3/02
Inventor 王俊锋廖平元郭志航钟孟捷刘少华王崇华庄伟雄温丙台刘焕添叶冬萌姚国欢王洪杰
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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