Processing technology of mildew-proof and heat-insulating plate

A processing technology and board technology, which is applied in the field of heat insulation materials, can solve the problems of mildew of plastic-wood composite materials, the loss resistance and stability of boards can not be effectively solved, and the treatment cycle is long, etc., to achieve a good mildew-proof effect

Inactive Publication Date: 2021-06-04
黄宜侦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, because the wood-plastic composite material is filled with a large amount of plant fibers, although the plant fibers are covered by plastic and acted on by coupling agents or compatibilizers, they are not as easy to be infected by mold and wood rot fungi as pure plant fibers, but when When it is wet in rainy days or the ground is soaked in water, the wood-plastic composite material can still provide a good living environment for fungi, causing the wood-plastic composite material to mildew, and the mechanical properties of the material will gradually decline, or even rot, greatly shortening its service life
At the same time, mildew will cause mold spots visible to the naked eye

Method used

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  • Processing technology of mildew-proof and heat-insulating plate

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A process for processing a mildew-proof and heat-insulating board. First, 100 g of fiber particles are mixed with 35 g of hydroxymethyl polystyrene resin, 15 g of polyvinylidene fluoride, and 5 g of maleic anhydride-grafted polystyrene to obtain a premix; then The premix is ​​extruded by blending and molded to obtain the described mildew-proof and heat-insulating board; wherein, the preparation method of the fiber particles is as follows:

[0038] (A) first carry out benzylation modification to the pretreated plant fiber powder to obtain benzylated plant fiber powder;

[0039](B) mixing the benzylated vegetable fiber powder with N-β(aminoethyl)-γ-aminopropyltriethoxysilane modified rock wool powder again to obtain mixed powder;

[0040] (C) then take ethyl orthosilicate and trimethyl borate as raw materials and mix to make sol, ultrasonically disperse the mixed powder in absolute ethanol to make prefabricated slurry, and then ultrasonically disperse the sol in absolute ...

Embodiment 2

[0059] A process for processing a mildew-proof and heat-insulating board. First, 100 g of fiber particles are mixed with 45 g of hydroxymethyl polystyrene resin, 12 g of polyvinylidene fluoride, and 7 g of maleic anhydride-grafted polystyrene to obtain a premix; then The premix is ​​extruded by blending and molded to obtain the described mildew-proof and heat-insulating board; wherein, the preparation method of the fiber particles is as follows:

[0060] (A) first carry out benzylation modification to the pretreated plant fiber powder to obtain benzylated plant fiber powder;

[0061] (B) mixing the benzylated vegetable fiber powder with N-β(aminoethyl)-γ-aminopropyltriethoxysilane modified rock wool powder again to obtain mixed powder;

[0062] (C) then take ethyl orthosilicate and trimethyl borate as raw materials and mix to make sol, ultrasonically disperse the mixed powder in absolute ethanol to make prefabricated slurry, and then ultrasonically disperse the sol in absolute...

Embodiment 3

[0081] A process for processing a mildew-proof and heat-insulating board, firstly mixing 100g of fiber particles with 40g of hydroxymethyl polystyrene resin, 13g of polyvinylidene fluoride and 6g of maleic anhydride grafted polystyrene to obtain a premix; then The premix is ​​extruded by blending and molded to obtain the described mildew-proof and heat-insulating board; wherein, the preparation method of the fiber particles is as follows:

[0082] (A) first carry out benzylation modification to the pretreated plant fiber powder to obtain benzylated plant fiber powder;

[0083] (B) mixing the benzylated vegetable fiber powder with N-β(aminoethyl)-γ-aminopropyltriethoxysilane modified rock wool powder again to obtain mixed powder;

[0084] (C) then take tetraethyl orthosilicate and trimethyl borate as raw materials and mix to make sol, ultrasonically disperse the mixed powder in absolute ethanol to make a prefabricated slurry, and then ultrasonically disperse the sol in absolute...

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Abstract

The invention relates to a processing technology of a mildew-proof and heat-insulating plate. The processing technology comprises the following steps: mixing fiber particles with hydroxymethyl polystyrene resin, polyvinylidene fluoride and maleic anhydride grafted polystyrene to obtain a premix; and then, carrying out blending extrusion and compression molding on the premix to obtain the plate. The plate has good mildew-proof and heat-insulating effects. A preparation method of the fiber particles comprises the following steps: firstly, carrying out benzylation modification on pretreated plant fiber powder to obtain benzylated plant fiber powder; uniformly mixing the benzylated plant fiber powder with the modified rock wool powder to obtain mixed powder; preparing the mixed powder into gel particles; and finally, adding the gel particles into a mixed solution of 1-aminopropyl-3-methylimidazolium hexafluorophosphate and 1-carboxyethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imine salt, and carrying out dipping treatment to obtain the fiber particles.

Description

technical field [0001] The invention belongs to the technical field of thermal insulation materials, and relates to a processing technology of a mildew-proof and thermal insulation board. Background technique [0002] Due to the continuous rise of ambient temperature and the problem of energy loss, thermal insulation and energy saving has become a social issue of concern. The development of thermal insulation boards and their high potential market prospects have become a problem that people are very concerned about. Plates are widely used and can be used in ships, vehicles, construction workshops and houses, etc. For the current energy shortage environment, their economic benefits are also more significant. [0003] At present, most of the thermal insulation boards on the market mostly rely on polyurethane foam, expanded polystyrene particles, and expanded phenolic to achieve thermal insulation, which has good thermal insulation effect and low price. Less safe to use. Exis...

Claims

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Application Information

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IPC IPC(8): C08L97/02C08L25/18C08L27/16C08L51/00C08K9/06C08K7/12B27K3/02B27K3/36B27N1/00B27N3/28
CPCB27K3/02B27K3/025B27K3/36B27K2200/15B27K2240/20B27N1/00B27N3/28C08L97/02C08L2205/035C08L25/18C08L27/16C08L51/003C08K9/06C08K7/12
Inventor 不公告发明人
Owner 黄宜侦
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