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A powder metallurgy preparation method of diamond composite heat dissipation material

A composite heat dissipation material and powder metallurgy technology, which is applied in the field of powder metallurgy, can solve the problems of poor thermal conductivity of composite heat dissipation materials, insufficient density of copper-based sintered matrix, and great difference in thermal expansion coefficient, etc., to reduce the number of interfaces, low cost, Effect of improving sintered density

Active Publication Date: 2022-03-04
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Since copper hardly wets diamond and the thermal expansion coefficient difference between diamond and diamond is very large, when using powder metallurgy to prepare thin slice diamond-copper matrix composite materials, there are often many problems when purely using copper powder and diamond for mixed sintering: The density of the copper-based sintered matrix is ​​insufficient. After cooling, due to the large difference in shrinkage coefficient between the copper matrix and the diamond, gaps are easily formed between the interfaces, which leads to poor thermal conductivity of the composite heat dissipation material; the sintered strength of the product is low, and it is easy to break
The thermal conductivity of diamond / copper composite heat dissipation block materials prepared by the existing powder metallurgy technology can reach 197-660W / mK, but they are all limited to the preparation of test samples with specific shapes, and it is difficult to implement large-scale production

Method used

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Examples

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Comparison scheme
Effect test

preparation example Construction

[0029] A powder metallurgy preparation method of a diamond composite heat dissipation material in this embodiment comprises the following steps:

[0030] S1: Selection of raw materials: Super diamond crystals prepared by using a nickel-plated diamond single crystal with a mass fraction of 6.5% to 13.6% (corresponding to a volume concentration of 60 to 120%) and a water atomization method with a mass fraction of 1 to 5% Fine CuSn15 bronze powder, 0.3-1.0% by mass of composite nickel-plated / copper carbon fiber, or composite nickel-plated / copper silicon carbide whiskers, the balance is electrolytic copper powder, and the alcohol solution of polyvinylpyrrolidone (K90) is Granulating agent;

[0031] S2: Cold-pressed billet: the raw material powder is mixed and granulated with K90 as the granulating agent, and the granulated material is cold-pressed into a sheet-shaped green body in a steel mold;

[0032] S3: Put the cold-pressed body into a hydrogen reduction furnace for high-temp...

Embodiment 1

[0044] 120 pieces of diamond / copper heat dissipation substrates with a specification of 15mm×15mm×2mm were prepared by using an ordinary four-column hot-pressing sintering machine. When designing the product, the designed amount of diamond added is described in terms of volume concentration according to industry practice (adding 4.4 carats of diamond to a volume of 1 cubic centimeter is defined as 100% volume concentration), and the actual input of diamond is converted according to the designed volume concentration. Weigh for weight. In the present embodiment, the parts by weight of nickel-plated diamond (35 / 40 order, nickel-plated weight gain 30%) are 11.4% (volume concentration is 80%), and the addition of ultrafine CuSn15 is 1% of total feeding weight, composite The addition amount of nickel / copper-plated carbon fiber is 0.5% of the total charge, and the balance is electrolytic copper powder. The selected materials are mixed and granulated, and the addition amount of the g...

Embodiment 2

[0059] 120 pieces of diamond / copper heat dissipation substrates with a specification of 15mm×15mm×2mm were prepared by using a six-sided top press. The proportioning of material and the weighing weight are identical with embodiment 1, namely: the volume concentration of diamond (35 / 40 order, nickel-plated weight gain 30%) is 80%, and the addition of superfine CuSn15 is 1% of total feeding weight , the addition of composite nickel / copper carbon fiber is 0.5% of the total feed, and the addition of granulating agent K90 is 0.5% of the feed weight.

[0060] According to the steps (1)-(3) of Example 1, the reduced pre-sintered body was prepared.

[0061] Put the pre-reduced sintered green body into the pyrophyllite sintered assembly block, the workpieces are separated by graphite pads with a thickness of 2mm, 10 pieces / mold. Under the conditions of 950°C and 5GPa in a six-sided top press, heat-preserve and sinter for 3 minutes, remove the mold and take out the parts after natural ...

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Abstract

The invention discloses a powder metallurgy preparation method of a diamond composite heat dissipation material, comprising the following steps: S1: selection of raw materials: nickel plating with a mass fraction of 6.5% to 13.6% (corresponding to a volume concentration of 60 to 120%) Diamond single crystal, superfine CuSn15 bronze powder prepared by water atomization method with a mass fraction of 1-5%, and composite nickel-plated / copper carbon fiber with a mass fraction of 0.3-1.0%, or composite nickel-plated / copper silicon carbide Whiskers, the balance is electrolytic copper powder, and the alcohol solution of polyvinylpyrrolidone (K90) is used as a granulating agent. S2: Cold-pressed billet: Cold-press the sheet-shaped billet in a steel mold after mixing and granulating the material. The flaky diamond / copper composite material obtained by the invention can be applied in the field of heat dissipation materials such as electronic packaging materials, and has good development prospects of simple method, large batch size and low cost.

Description

technical field [0001] The invention relates to the technical field of powder metallurgy, in particular to a powder metallurgy preparation method of a diamond composite heat dissipation material. Background technique [0002] The miniaturization and integration of electronic components has led to a sharp increase in the heat flux density of power devices, and accordingly puts forward higher requirements for heat dissipation materials. Heat dissipation materials mainly include metal-based heat dissipation materials, ceramic-based insulating and heat-conducting materials, and polymer-based high-heat-conducting materials. At present, these common heat dissipation materials are gradually difficult to meet the high heat dissipation requirements of electronic devices, so it is an inevitable trend to develop new heat dissipation materials with high thermal conductivity. [0003] Diamond is the material with the highest thermal conductivity known in the world, which can reach (600-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C47/14C22C49/02C22C49/14C22C121/02C22C101/10C22C101/14
CPCC22C47/14C22C49/02C22C49/14
Inventor 董书山徐航董欣然孙贵乾姜丽娜陶强朱品文
Owner JILIN UNIV
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