High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method of high-dispersion nickel inner electrode slurry

A technology of multilayer chip ceramics and capacitors, applied in fixed capacitor electrodes, laminated capacitors, fixed capacitor dielectrics, etc., can solve problems such as discontinuity, limited dispersion of nano-powders, and influence on the electrical properties of MLCC products

Active Publication Date: 2021-06-18
西安宏星电子浆料科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional process has limited ability to disperse nano-powder, and there are holes and discontinui...

Method used

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  • High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method of high-dispersion nickel inner electrode slurry
  • High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method of high-dispersion nickel inner electrode slurry
  • High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method of high-dispersion nickel inner electrode slurry

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preparation example Construction

[0046] Based on the above findings, the present invention provides a method for preparing a nickel internal electrode slurry for MLCC, comprising the following steps:

[0047] (1) Ni powder without residual dispersant, BaTiO without residual dispersant 3 Powder, organic solvent, dispersant and NiW alloy powder preferably added without residual dispersant are mixed evenly to obtain slurry A;

[0048] (2) Use a sand mill to sand slurry A to obtain slurry B;

[0049] (3) Add binder to slurry B, mix evenly to obtain slurry C;

[0050](4) Use an emulsifier to emulsify the slurry C to obtain a nickel internal electrode slurry for MCC.

[0051] In the present invention, for preparing the Ni powder of slurry A, BaTiO 3 Powder and NiW alloy powder do not contain residual dispersant. In the production of Ni powder, BaTiO 3 Dispersants are usually used in the process of Ni powder and NiW alloy powder, resulting in Ni powder, BaTiO 3 Powder and NiW alloy powder products contain a ce...

Embodiment 1

[0085] This embodiment prepares a highly dispersible nickel internal electrode slurry for MLCC, which specifically includes the following steps:

[0086] (1) Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder preparation:

[0087] Ni powder, BaTiO 3 Powder and NiW alloy powder are mixed uniformly by a mixer to obtain Ni / BaTiO 3 / NiW homogeneous powder, among them, Ni powder and BaTiO 3 The mass ratio of powder is 1:0.12, and the mass fraction of NiW alloy powder is Ni powder and BaTiO 3 0.5% of the total weight of powder. Ni / BaTiO 3 / NiW homogeneous powder was heat-treated at 300°C for 4 hours in a nitrogen atmosphere rotary furnace to obtain Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder.

[0088] (2) Sanding dispersion:

[0089] Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder, organic solvent and dispersant to adjust to Ni / BaTiO with a solid content of 40% 3 / NiW slurry, wherein the mass fraction of dispersant is Ni / BaTiO ...

Embodiment 2

[0095] This embodiment prepares a highly dispersible nickel internal electrode slurry for MLCC, which specifically includes the following steps:

[0096] (1) Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder preparation:

[0097] Ni powder, BaTiO 3 Powder and NiW alloy powder are mixed uniformly by a mixer to obtain Ni / BaTiO 3 / NiW homogeneous powder, among them, Ni powder and BaTiO 3 The mass ratio of powder is 1:0.28, and the mass fraction of NiW alloy powder is Ni powder and BaTiO 3 1% of the total weight of powder. Ni / BaTiO 3 / NiW homogeneous powder was heat-treated at 400°C for 3 hours in a nitrogen atmosphere rotary furnace to obtain Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder.

[0098] (2) Sanding dispersion:

[0099] Ni / BaTiO without residual dispersant 3 / NiW homogeneous powder, organic solvent and dispersant to adjust to Ni / BaTiO with a solid content of 50% 3 / NiW slurry, wherein the mass fraction of dispersant is Ni / BaTiO 3...

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Abstract

The invention discloses a preparation method of nickel inner electrode slurry for a multilayer chip ceramic capacitor. The method comprises the following steps of (1) uniformly mixing Ni powder without residual dispersing agent, BaTiO3 powder without residual dispersing agent, NiW alloy powder without residual dispersing agent, an organic solvent and a dispersing agent to obtain slurry A; (2) sanding the slurry A by using a sand mill to obtain slurry B; (3) adding a binder into the slurry B, and uniformly mixing to obtain slurry C; and (4) emulsifying the slurry C by using an emulsifying machine to obtain the nickel inner electrode slurry for the multilayer chip ceramic capacitor. The method is advantaged in that the nickel inner electrode slurry prepared by the method is high in dispersity, simple in preparation process and low in cost, industrial production can be realized, and a multilayer chip ceramic capacitor prepared from the nickel inner electrode slurry is few in inner electrode holes and good in electrical property.

Description

technical field [0001] The invention belongs to the field of internal electrodes for multilayer chip ceramic capacitors, in particular to highly dispersed nickel internal electrode slurry for multilayer chip ceramic capacitors and a preparation method thereof. Background technique [0002] Chip multi-layer ceramic capacitors (Multi-layer Ceramic Capacitors, MLCC) are laminated by ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering, and then in the chip. A capacitor made by sealing both ends with a metal layer (external electrode). In addition to the common characteristics of capacitors "blocking direct traffic", MLCC also has the characteristics of small size, long life, high reliability, high integration, and suitable for surface mounting. It is widely used in various electronic complete machines and electronic equipment, such as Computers, telephones, program...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B1/22H01G4/008H01G4/30H01G4/12
CPCH01B1/22H01B13/00H01G4/008H01G4/30
Inventor 曾艳艳谭彪赵科良张建益吴高鹏鹿宁肖雄徐小艳
Owner 西安宏星电子浆料科技股份有限公司
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