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Copper inner electrode conductive paste for multilayer ceramic capacitor and application of copper inner electrode conductive paste

A technology of multi-layer ceramics and conductive paste, applied in the direction of fixed capacitor electrodes, laminated capacitors, capacitors, etc., can solve the problems of fast shrinkage, easy oxidation of copper paste, electron migration, etc., to prevent oxidation and improve the continuity of the copper layer , good conductivity

Active Publication Date: 2021-07-27
大连海外华昇电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the internal electrode pastes used in the production of multilayer ceramic capacitors mainly include silver paste, silver-palladium paste, and copper paste. Due to the problems of easy oxidation, fast shrinkage and electron migration of copper paste itself, its large-scale use is limited.

Method used

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  • Copper inner electrode conductive paste for multilayer ceramic capacitor and application of copper inner electrode conductive paste
  • Copper inner electrode conductive paste for multilayer ceramic capacitor and application of copper inner electrode conductive paste

Examples

Experimental program
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Embodiment 1

[0064] A method for preparing the above-mentioned multilayer ceramic capacitor copper internal electrode conductive paste, such as figure 2 Shown, the SEM figure of the conductive paste prepared for the inventive method and formula specifically comprises the following steps:

[0065] S1. Grinding of ceramic powder:

[0066] The ceramic powder is a mixture of zinc oxide, barium oxide and zirconia, prepare 45g, ball mill the ceramic powder, the ball milling speed is 12~16m / s, and ball mill until the specific surface area of ​​the ceramic powder is less than or equal to 20m 2 / g and uniform particle size to prevent agglomeration and large particles;

[0067] S2, preparation of glue:

[0068] Mix and stir 300g of dihydroabietyl acetate, 13g of polyvinyl butyral and 0.6g of polyamide wax. The stirring time is 6 hours to 8 hours, the stirring temperature is 10-20°C, and the stirring speed is 800-1200 rpm / min, the obtained mixture is subjected to pressure filtration, the filtrat...

Embodiment 2

[0079] A method for preparing the above-mentioned multilayer ceramic capacitor copper internal electrode conductive paste, comprising the steps:

[0080] S1. Grinding of ceramic powder:

[0081] The ceramic powder is a mixture of zinc oxide, barium oxide and zirconia, prepare 50g, and ball mill the ceramic powder at a speed of 12 to 16m / s until the specific surface area of ​​the ceramic powder is less than or equal to 20m 2 / g and uniform particle size to prevent agglomeration and large particles;

[0082] S2, preparation of glue:

[0083] 420g of terpineol, 15g of ethyl cellulose and 0.6g of polyamide wax were mixed and stirred, the stirring time was 6 hours to 8 hours, the stirring temperature was 10-20°C, and the stirring speed was 800-1200rpm / min, the obtained mixture Perform pressurized filtration, the filtration pressure is 2-4psi, and the filtration speed is 1-4L / min, to obtain the glue;

[0084] Weigh each substance according to the mass ratio of 5% to 15% of the gl...

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Abstract

The invention provides a copper inner electrode conductive slurry for a multilayer ceramic capacitor and an application of the copper inner electrode conductive paste. The conductive paste comprises the following raw materials in parts by mass: 40-50 parts of copper powder; 0.1 to 2 parts of tantalum powder; 1-5 parts of ceramic powder; 0.1-2 parts of a dispersant; 0.1 to 0.2 part of a stabilizing agent; and 22.1 to 43 parts of glue. The glue comprises the following substances: an organic solvent, resin and a thixotropic agent in a mass ratio of (80-98): (2-4): (0.1-0.2). According to the invention, tantalum powder and mixed ceramic powder are added into a copper paste formula, an appropriate dispersing agent is selected, and the surface of copper powder is coated with oleic acid, so that oxidation of the copper paste can be effectively prevented before the copper paste is formed, the copper powder is better dispersed in the subsequent processing process, and copper electron migration can be effectively prevented during sintering due to addition of the tantalum powder. And the mixed ceramic powder is added to effectively inhibit the shrinkage of the copper electrode, so that the continuity of the copper layer is good.

Description

technical field [0001] The present invention relates to the technical field of conductive paste, in particular to a kind of copper internal electrode conductive paste for multilayer ceramic capacitors and its application. Background technique [0002] Multilayer ceramic capacitors (Multilayer Ceramic Capacitor, MLCC) is the most widely used type of chip components, with the characteristics of small size, high specific capacitance, and high precision, effectively reducing the size of electronic information terminal products (especially portable products) Volume and weight, improve product reliability. [0003] At present, the internal electrode pastes used in the production of multilayer ceramic capacitors mainly include silver paste, silver-palladium paste, and copper paste. Due to the problems of easy oxidation, fast shrinkage and electron migration of copper paste itself, its large-scale use is limited. If the above problems can be solved, copper paste will be more widely...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/008H01G4/30H01B1/16H01B1/22
CPCH01G4/0085H01G4/30H01B1/16H01B1/22Y02E60/13
Inventor 高珺李岩陈将俊纪煊刘春静
Owner 大连海外华昇电子科技有限公司
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