The invention provides a radiation cured adhesive for indium tin oxide (ITO) circuit and module protection, which comprises the following components in percentage by mass: 30 to 70 percent of polysiloxane-acrylic ester, 10 to 50 percent of polyester acrylate, 0 to 40 percent of reactive diluent, 0.2 to 8 percent of photoinitiator, 0.1 to 5 percent of coupling agent, 0 to 2 percent of antiaging agent and 0 to 2 percent of defoamer, wherein the reactive diluents is an acrylate with a single(double or multiple) functional group; the photoinitiator is a cracking initiator, a hydrogen abstracting type initiator or a combination of the two; the coupling agent is a silane coupling agent; and the antiaging agent is one or several of a phenol antioxygen, an amine antioxygen, a sulfur compound antioxygen, a phosphorus compound antioxygen and an organic metal salt antioxygen. In the curing process of the adhesive, moisture is not required to participate in reaction, the adhesive can be cured quickly in the irradiation of ultraviolet, and then package can be accomplished; and thus, the production efficiency is improved greatly, energy is saved and raw material cost is reduced.