Radiation cured adhesive for indium tin oxide (ITO) circuit and module protection

A technology of radiation curing and adhesives, which is applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., which can solve the problems of long time, at least 48 hours, poor fluidity of RTV-1, hidden dangers of LCM reliability, etc. problems, to achieve the effects of high environmental test reliability, good product application reliability, and improved production efficiency and yield
CN102102007BActive Publication Date: 2013-04-24DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DONGGUAN POWERBOND NEW MATERIALS TECH DEV
Publication Date
2013-04-24

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Abstract

The invention provides a radiation cured adhesive for indium tin oxide (ITO) circuit and module protection, which comprises the following components in percentage by mass: 30 to 70 percent of polysiloxane-acrylic ester, 10 to 50 percent of polyester acrylate, 0 to 40 percent of reactive diluent, 0.2 to 8 percent of photoinitiator, 0.1 to 5 percent of coupling agent, 0 to 2 percent of antiaging agent and 0 to 2 percent of defoamer, wherein the reactive diluents is an acrylate with a single(double or multiple) functional group; the photoinitiator is a cracking initiator, a hydrogen abstracting type initiator or a combination of the two; the coupling agent is a silane coupling agent; and the antiaging agent is one or several of a phenol antioxygen, an amine antioxygen, a sulfur compound antioxygen, a phosphorus compound antioxygen and an organic metal salt antioxygen. In the curing process of the adhesive, moisture is not required to participate in reaction, the adhesive can be cured quickly in the irradiation of ultraviolet, and then package can be accomplished; and thus, the production efficiency is improved greatly, energy is saved and raw material cost is reduced.
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Description

technical field

[0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive for protecting COG, COF, and TAB modules of LCD liquid crystal screens, in particular to a radiation-cured adhesive for protecting ITO circuits and modules. Background technique

[0002] In the LCD panel manufacturing process, it can be roughly divided into three stages, which are Array process, Cell process and Module process. The Array process refers to the fabrication of thin-film transistors (TFT) and color filters (CF) on a glass substrate; the Cell process uses the glass substrate of the TFT as the substrate, and combines it with the glass substrate of the CF. Liquid crystal (ODF process) is dripped between the substrates and the backlight plate is bonded to form an LCD panel (LCD panel); while the Module process is to assemble the driver IC, flexible circuit and some mechanical parts after inspecting the appearance of the LCD panel, and finally A...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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