Preparation of dual-functional lightweight electronic packaging materials with both thermal conductivity and electromagnetic wave absorption
An electronic packaging material, dual-function technology, applied in the field of dual-function lightweight packaging materials based on three-dimensional carbon network structure-polymer substrate, can solve the problem of low filling amount of three-dimensional carbon skeleton CNF@C-M, large inorganic filling amount and single function and other problems, to achieve the effects of high-performance thermal conductivity and electromagnetic wave absorption, reduction of preparation costs, and simple synthesis process
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Embodiment 1
[0047] 400mg of bacterial cellulose was carried out in sodium hydroxide solution (such as a sodium hydroxide solution with a concentration of 0.5M; the lye can especially be a hot lye, and what was used in this embodiment was a sodium hydroxide solution at 80°C). After removing impurities and activating the surface functional groups pretreatment, place in 400mg Ni(NO 3 ) 2 6(H 2 O) and 70 mg of terephthalic acid in a DMF solution were stirred for 30 min, and then transferred to a polytetrafluoroethylene reactor for solvothermal reaction. The specific reaction conditions were heating at 150° C. for 3 h. The reaction product was washed with water and ethanol three times respectively, and then placed in a tube furnace for high-temperature carbonization treatment. The specific reaction conditions were: heating to 900°C at a heating rate of 2°C / min, and keeping warm under an atmosphere of flowing argon gas 2 hours. The carbonized product was collected and impregnated with epoxy ...
Embodiment 2
[0050] 400mg of bacterial cellulose was pretreated in sodium hydroxide solution to remove impurities and activate surface functional groups, and then placed in 400mg Ni(NO 3 ) 2 6(H 2 O) and 70 mg of terephthalic acid in a DMF solution were stirred for 30 min, and then transferred to a polytetrafluoroethylene reactor for solvothermal reaction. The specific reaction conditions were heating at 150° C. for 3 h. The reaction product was washed with water and ethanol three times respectively, and then placed in a tube furnace for high-temperature carbonization treatment. The specific reaction conditions were: heating to 900°C at a heating rate of 2°C / min, and keeping warm under an atmosphere of flowing argon gas 2 hours. The collected carbonized product (CNF@C-Ni) was impregnated with epoxy resin at a mass ratio of 1:40 and 1:10 under vacuum at 120 °C to prepare a dual-functional lightweight electronic packaging material.
[0051] According to the measurement method in Example 1...
Embodiment 3
[0053] The dual-functional light-weight electronic packaging material prepared in Example 1 was used to collect the thermal conductivity of pure epoxy resin and composite material in XIATECH TC3010 instrument through the transient hot wire method. The thermal conductivity of pure epoxy resin was only 0.18W·m -1 K -1 , however, the introduction of a small amount of three-dimensional carbon framework enables the thermal conductivity of the composite to reach 0.5W m -1 K -1 , is 2.77 times that of pure epoxy resin. In addition, the thermal management capabilities of the packaging material during the heating and cooling processes were recorded by an infrared thermal imager, which verifies that the material has excellent application prospects.
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