Copper alloy plate, copper alloy plate with coating, and method for producing the same
A copper alloy plate and a manufacturing method technology, applied in manufacturing tools, chemical instruments and methods, metal processing and other directions, can solve the problems of reduced adhesion between coating and base material, increased contact resistance of coating, deterioration of electrical connection reliability, etc.
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Embodiment 1
[0095] An ingot containing more than 1.2 mass % and 2 mass % or less of Mg (ie, the central Mg concentration exceeding 1.2 mass % and 2 mass % or less) and the remainder consisting of Cu and unavoidable impurities was prepared, and subjected to hot rolling according to a conventional method , intermediate annealing, cold rolling, etc. to produce a plate-shaped copper alloy base material.
[0096] Next, the copper alloy base material is subjected to Mg concentration treatment by heating at a heating temperature of 200 to 300° C. and a heating time of 1 minute to 5 hours in an oxidizing atmosphere, and then subjected to a surface portion removal treatment to produce Copper alloy plates with various Mg concentration gradients.
[0097] The copper alloy plate is subjected to surface removal treatment by physical polishing, chemical polishing, or electrolytic polishing. Physical grinding uses polishing grinding, chemical grinding is immersing in a polishing liquid prepared by addi...
Embodiment 2
[0128] Next, each copper alloy plate of Example 1 was subjected to treatments such as degreasing, pickling, etc., and then Cu plating treatment was performed under the Cu plating conditions shown in Table 1 to form Cu plating layers, followed by Sn plating shown in Table 2 Plating Conditions Sn plating treatment was performed to form Sn plating layers, and the copper alloy sheets on which these plating layers were formed were subjected to reflow processing to prepare copper alloy sheets with plating films.
[0129] In the reflow process, the plating layer is heated to a temperature of 230° C. or higher and 330° C. or lower, and then cooled to a temperature of 60° C. or lower.
[0130] Then, a sample was cut out from the copper alloy plate with the plating film, and the surface Mg concentration, the contact resistance of the surface, and the adhesion of the plating film were measured. The measurement method of the contact resistance is the same as that of Example 1.
[0131] T...
Embodiment 3
[0151] In the same manner as in Example 1, a sample having a central Mg concentration of 1.3 mass % and a concentration gradient of 0.2 mass % / µm was prepared. Samples having the same concentration gradient but different surface Mg concentrations were prepared by changing the surface portion removal amount in the surface portion removal treatment at the time of production. The produced sample was plated by the same method as Example 2 to produce a plated copper alloy plate, and the adhesion and contact resistance of the plated film of the plated copper alloy plate were measured. The results are shown in Table 7.
[0152] [Table 7]
[0153] Center Mg concentration 1.3 (mass %)
[0154]
[0155] As shown in Table 7, in the samples in which the surface Mg concentration exceeded 30% of the center Mg concentration, the adhesion and contact resistance of the plating film deteriorated.
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