Electrolyte plasma polishing electrolyte solution for nickel-based superalloy and polishing method of electrolyte plasma polishing electrolyte solution
A nickel-based superalloy and electrolyte technology, applied in the field of ion polishing nickel-based superalloy, can solve the problems of high toxicity, difficult disposal of waste liquid, high risk, etc., and achieve the effects of low cost, simple preparation and short polishing time
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Embodiment 1-10
[0029] The components of the electrolyte plasma polishing electrolyte provided in Examples 1-10 are shown in Table 1-2. The solvent used in each example is water, which is not listed in the table. The percentages shown in Tables 1-2 are all percentages by weight in aqueous solution.
[0030] Table 1-2 compares the workpiece surfaces after electrolyte plasma polishing with different electrolytes in Examples 1-10, and the evaluation indicators include: material removal rate, current efficiency, surface morphology and surface roughness.
[0031] Polishing method, comprises the following steps:
[0032] (1) Add the mixed electrolyte into the water, stir well until the mixture is uniform, heat to 70-75°C, and add the prepared polishing solution into the polishing tank;
[0033] (2) Clamp the nickel-based high-temperature alloy workpiece to be polished to a special fixture after cleaning, and immerse it in the electrolyte, and the immersion depth is 10-50mm;
[0034] (3) Connect t...
Embodiment 1
[0039] The polishing effect of embodiment 1 gained polishing liquid is the best, asfigure 1 As shown in B, the workpiece surface has obtained a good surface gloss after polishing.
Embodiment 2
[0040] Embodiment 2, 3 have investigated the situation that only adopt inorganic salt ammonium sulfate, ammonium chloride aqueous solution to polish without adding complexing agent, the result can be seen, when only using sulfate or other inorganic salts as electrolytic solution, workpiece surface can blacken and Accompanied by severe corrosion and even a large number of melting pits, see figure 1 C. figure 1 d.
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Abstract
Description
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Application Information
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