Preparation method of high-heat-resistance halogen-free CEM-1 copper-clad plate

A CEM-1, high heat resistance technology, applied in chemical instruments and methods, paper/cardboard layered products, manufacturing printed circuit precursors, etc. Effects of excellent punching workability, reduced flammability, improved processing efficiency and welding reliability

Pending Publication Date: 2022-03-01
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the CEM-1 board, the lining reinforcement material is wood pulp paper, which itself is flammable. To reach the FV0 level, a large amount of nitrogen and phosphorus flame retardants are required, which will inevitably affect other properties of the board, resulting in its heat resistance. , generally poor flexibility

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A preparation method of a high heat-resistant halogen-free CEM-1 copper clad laminate, comprising the steps of:

[0025] (1) Preparation of surface material prepreg glue: 30 parts of DOPO type epoxy resin, 3.5 parts of alkyl long chain modified toughened epoxy resin, 5 parts of low molecular weight epoxy E-51, 1.5 parts of latent curing agent DICY, 2 parts of phenol novolac resins, 28 parts of aluminum hydroxide: the mixed surface material filler of magnesium hydroxide=1:1, 30 parts of DMF: the mixed solvent of butanone=4:1, mix, stir;

[0026] (2) Preparation of lining-impregnated resin glue: 10 parts of high heat-resistant phosphorus-containing flame retardant with phosphorus content of 23%, 90 parts of mixed solvent of methanol:acetone=4:1, mix and stir evenly;

[0027] (3) Preparation of the second-impregnation resin glue for the lining: modify 22 parts of low-molecular phosphorus-containing epoxy DOPO epoxy resin, 10 parts of low-molecular E-51 epoxy, 13 parts of n...

Embodiment 2

[0032] A preparation method of a high heat-resistant halogen-free CEM-1 copper clad laminate, comprising the steps of:

[0033] (1) Preparation of surface material prepreg glue: 25 parts of DOPO type epoxy resin, 10 parts of HQ modified DOPO epoxy resin, 3.5 parts of alkyl long chain modified toughened epoxy, 3 parts of low molecular weight epoxy E-51, 1.0 parts of DICY: DDS = 2:1 mixed latent curing agent, 3 parts of phenol novolac resin, 20 parts of magnesium hydroxide, 5 parts of nitrogen phosphorus flame retardant, 27.5 parts of DMF: propylene glycol methyl ether = 1: 1 mixed solvent, mix and stir evenly;

[0034] (2) Preparation of lining-impregnated resin glue: mix 12 parts of high heat-resistant phosphorus-containing flame retardant with a phosphorus content of 23%, and 88 parts of solvent methanol, and stir evenly;

[0035] (3) Preparation of the second-impregnation resin glue solution for the lining: 24 parts of low-molecular phosphorus-containing epoxy DOPO epoxy re...

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PUM

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Abstract

The invention relates to a preparation method of a high-heat-resistance halogen-free CEM-1 copper-clad plate. The preparation method comprises the following steps: 1) preparing a surface material prepreg glue solution; (2) preparing a first lining impregnated resin glue solution; (3) preparing a lining secondary dipping resin glue solution; (4) preparing a surface material prepreg; (5) preparing a lining prepreg; and (6) preparing the CEM-1 copper-clad plate. A small amount of phenolic resin is added into a surface material glue solution curing system provided by the invention, so that the matching property of a surface material and a lining material can be improved, and the bonding strength of an interface is improved and the heat resistance is improved; the high-heat-resistance phosphorus-containing resin is used as the lining first-dipping resin glue solution, so that the flammability of the wood pulp paper can be greatly reduced, the use of melamino-formaldehyde resin or other thermosetting low-molecular resin is avoided, and the flexibility and the stability of the product are improved.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a preparation method of a high heat-resistant halogen-free CEM-1 copper-clad laminate. Background technique [0002] Copper clad laminates are widely used in the manufacture of printed circuit boards used in various household appliances, electronic information products and industrial electronic products. It is an important electronic basic material for the three functions of insulation between lines and lines. [0003] The flame retardancy of CCL is one of the important safety performances of electronic products. Halogen-based flame-retardant materials (including Cl, Br) have been used in the printed circuit substrate industry for many years due to their economy and reliability. However, with the increasing calls for global environmental protection, the use of halogen-based flame-retardant The environmental load and its impact on human health are being...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B29/00
CPCB32B29/005B32B29/06B32B5/02B32B29/02B32B15/20B32B15/14B32B37/06B32B37/10B32B38/08C08J5/24H05K3/022C08K2003/2227C08K2003/2224C08J2363/00C08J2463/00C08J2461/06C08J2497/02C08K7/14B32B2262/101B32B2260/021B32B2260/046B32B2260/028B32B2307/306B32B2307/558B32B2307/3065B32B2457/08
Inventor 杨永亮郑宝林陈长浩栾好帅王彦谢峰姜大鹏
Owner SHANDONG JINBAO ELECTRONICS
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