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Manufacturing method of high-density interconnected printed circuit board

A printed circuit board, high-density interconnection technology, applied in printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of uneven heat dissipation, unsuitable power, and high cost, improve thermal conductivity, and facilitate disassembly and maintenance. , the effect of good insulation performance

Active Publication Date: 2022-03-08
GUANGDE BAODA PRECISION CIRCUIT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. If a miniature radiator is used, its volume is too large and the cost is high. If it is a metal heat conduction radiator, it only has a good heat dissipation effect in the heat dissipation area, resulting in uneven heat dissipation, and breakdown is prone to occur at the radiator installation place. Not suitable for high power working conditions;
[0005] 2. The thermal conductivity of the double-sided adhesive is not good, and the bonding strength is not high. If a large area of ​​double-sided adhesive is used to improve the bonding strength, the heat dissipation performance is limited, which limits the use of the circuit board

Method used

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  • Manufacturing method of high-density interconnected printed circuit board
  • Manufacturing method of high-density interconnected printed circuit board
  • Manufacturing method of high-density interconnected printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] This embodiment prepares a thermally conductive adhesive, and the specific implementation process is as follows:

[0034] Step A1: Take 1L of di-p-toluene sulfide solution and 15g of aluminum trichloride powder, and stir in a high-speed stirrer at a stirring rate of 1500rmp to form a suspension, and then put magnetons into the suspension to set Stirring rate is 300rmp, in the state of stirring, pass through the catheter into the suspension to react with chloroform, the amount of chloromethane introduced is 0.1m 3 , the feeding time of monochloromethane is 2h, and then the reaction solution is ventilated in a fume hood and placed overnight, so that the aluminum chloride in the reaction solution is sublimated, and the intermediate reaction solution is obtained. Under the catalysis of aluminum chloride, Friedel-Crafts reaction between di-p-toluene sulfide and methylene chloride;

[0035] The di-p-toluene sulfide solution is prepared by uniformly mixing di-p-toluene sulfid...

Embodiment 2

[0041] This embodiment prepares a thermally conductive adhesive, the specific implementation process is the same as that of Example 1, only the reaction process parameters are adjusted, as follows:

[0042] In step A2, the reaction temperature of the intermediate reaction liquid and potassium permanganate is raised to 75°C;

[0043] In step A3, the reaction time of p-phenylenediamine, EDA and the target reaction solution is 30 hours, and then the temperature is raised to 35°C;

[0044] In step A5, the dosage ratio of the modified nano-alumina and the adhesive is 6.5g:500mL.

Embodiment 3

[0046] This embodiment makes a high-density interconnection printed circuit board, please refer to Figure 1-2 As shown, the specific production method is as follows:

[0047] Step S1: Take the circuit substrate 20, which is a common phenolic resin-based thermosetting circuit substrate 20 in the market, clean both sides of the circuit substrate 20, apply adhesive glue on both sides of the circuit substrate 20, and apply adhesive on both sides of the circuit substrate 20. Glue the copper sheet 30, the copper sheet 30 is a commercially available circuit copper sheet 30, and the thickness is selected according to the actual application. In this embodiment, an electrical copper foil with a thickness of 0.5 mm is used to degrease, etch, level and clean the copper sheet 30 , to get the composite veneer;

[0048] Step S2: Coating a layer of heat-conducting adhesive on both sides of the composite veneer, trimming and leveling the applied heat-conducting adhesive to form a heat-conducti...

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Abstract

The invention relates to a manufacturing method of a high-density interconnected printed circuit board, and belongs to the technical field of high-power-density interconnected mainboards, the circuit board is manufactured by hot-pressing a plurality of groups of gluing plates, copper wire meshes are arranged between glue layers of the gluing plates, the copper wire meshes uniformly and efficiently exchange heat between layers of the circuit board, and two ends of each copper wire mesh extend to the outer side of the circuit board, so that the circuit board is manufactured. Heat dissipation is carried out through the plurality of heat dissipation sites; besides, the heat-conducting adhesive is adopted, the molecule of the heat-conducting adhesive has an imide ring (-CO-N-CO-) structure, the heat-conducting adhesive has good insulating property, meanwhile, a certain proportion of modified nano aluminum oxide is doped into the heat-conducting adhesive, the heat-conducting property of the adhesive is improved, the adhesive is synthesized by taking di-p-toluene sulfide as a raw material, and the heat-conducting property of the adhesive is improved. Thioether bonds are introduced into polymer molecules, so that the glass transition temperature of the heat-conducting adhesive is reduced, and the later machinability is improved.

Description

technical field [0001] The invention belongs to the technical field of high-power-density interconnected motherboards, and in particular relates to a manufacturing method of a high-density interconnected printed circuit board. Background technique [0002] A high-density printed circuit board is a structural component formed by insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components and other various electronic components will be installed on it. Components, therefore, a printed circuit board is a platform that provides the connection of components. [0003] Chinese patent CN105916291B discloses a method for manufacturing high-density interconnected printed circuit boards. A radiator is arranged between adjacent unit circuit boards, and double-sided adhesive is used for bonding, which has the following problems: [0004] 1. If a miniature radiator is used, its volume is too large and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/46H05K1/03H05K1/02C09J179/08C09J11/04C08G73/10
CPCH05K3/386H05K3/4611H05K1/0207H05K1/0209H05K1/0203H05K1/0353C09J179/08C09J11/04C08G73/1064C08G73/1007C08K2201/011C08K2003/2227C08K3/22
Inventor 沈剑祥周萌陈云峰董涛
Owner GUANGDE BAODA PRECISION CIRCUIT CO LTD
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