Novel antistatic heat-resistant glue and preparation method thereof

Abstract

The novel antistatic heat-resistant glue is prepared from the following components in parts by mass: 100 parts of acrylic resin, 10-50 parts of an acrylonitrile-butadiene-styrene copolymer, 2-10 parts of silicon dioxide, 1-5 parts of an anti-aging agent, 1-5 parts of a coupling agent, 1-5 parts of an antibacterial preservative and 1-10 parts of absolute ethyl alcohol. The coating is prepared from the following components in parts by weight: 5-20 parts of methyl silicone resin, 10-30 parts of phenyl hydrogen-containing silicone resin, 1-5 parts of a cross-linking agent, 1-5 parts of a defoaming agent, 0.1-5 parts of zinc oxide, 0.1-5 parts of graphene sheets, 0.1-5 parts of carbon nanotubes and 0.1-5 parts of silicon nitride. According to the invention, zinc oxide, graphene sheets and carbon nanotubes are selected to form a three-dimensional conductive network through a point-line-plane conduction mode, so that the antistatic effect of the glue is effectively improved; the methyl silicone resin, the phenyl hydrogen-containing silicone resin and the silicon nitride filler are selected, so that the heat resistance and aging resistance of the glue are improved, the viscosity of the glue can be adjusted by adjusting the ratio of the methyl silicone resin to the phenyl hydrogen-containing silicone resin, and the glue can adapt to more application scenes.

Description

technical field [0001] The invention relates to a glue and a preparation method of the glue. Background technique [0002] With the advent of the intelligent age, the rapid development of the electronics industry and the semiconductor industry, and the increasingly high level of integrated electronic equipment, the requirements for antistatic performance and heat resistance of products are getting higher and higher. [0003] The Mini-LED backlight module uses Mini-LED as the backlight to reduce the size of the direct-type LED backlight module, and turns dozens of LED lamp beads into thousands, tens of thousands, or even more lights. beads. Compared with traditional backlights, Mini-LED has more advantages and is suitable for high-end liquid crystal display solutions. However, due to the small size of the light-emitting LED, the display is prone to electrostatic breakdown during the preparation and assembly process, resulting in LED inactivation, and Compared with tradition...

AI Technical Summary

Problems solved by technology

Compared with traditional backlights, Mini-LED has more advantages and is suitable for high-end liquid crystal display solutions. However, due to the small size of the light-emitting LED, the display is prone to electrostatic breakdown during the preparation and assembly process, resulting in LED inactivation, and Compared with traditional displays, a large number of LEDs emit more heat during use, which can easily make ordinary adhesives less viscous and cause problems such as product components falling off