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Preparation method and application of chemical black nickel plating solution

A technology of chemical plating and black nickel, which is applied in the direction of liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of limited application range, insufficient corrosion resistance of the plating layer, insufficient discoloration resistance, and high production cost, and achieve The reduction deposition rate is easy to control, the physical and chemical properties are easy to control, and the effect of rich complexes

Pending Publication Date: 2022-04-19
东莞奕创表面处理科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, nickel sulfate, hypophosphorous acid reducing agent system electroless nickel plating technology obtained nickel plating is a single metal silver-white coating, and the adhesion of the coating is poor, and the corrosion resistance and discoloration resistance of the coating are insufficient; therefore, the plating obtained by this technology The scope of application of nickel plating plating is not wide
Therefore, the requirements for production equipment are relatively high, and the energy consumption is also high, resulting in high production costs.

Method used

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  • Preparation method and application of chemical black nickel plating solution
  • Preparation method and application of chemical black nickel plating solution
  • Preparation method and application of chemical black nickel plating solution

Examples

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preparation example Construction

[0040] A kind of preparation method of chemical black nickel plating solution of the present invention, comprises the steps:

[0041] §1. Prefabricated liquid: under the condition of 35-55°C, dissolve every 3-8g of surfactant and 5-30g of nickel complex in sequence in 1L of aqueous solution of additive A with a concentration of 10-35g / L;

[0042] §2. Adding auxiliary metal ions: Add 25-125g of nickel sulfate, 5-30g of nickel acetate, 2-12g of manganese salt, and 1-6g of zinc to the solution obtained in step §1 at 35-55°C. compound, 0.5-3g silver nitrate, stir until all salts are completely dissolved;

[0043] §3. Prepare the main solution: Add 3-25g of additive B and 2-8g of additive C to the solution obtained in step §2 at 35-55°C, respectively, and stir until additive B and additive C are completely dissolved. Obtain chemical black nickel main solution (hereinafter referred to as "main solution");

[0044] §4. Preparation of reducing solution: under the condition of 35-55°...

Embodiment 1

[0070] A preparation method of chemical black nickel plating solution, prepared according to the following steps:

[0071] §1. Dissolve 3g of SDS and 5g of CS-Ni in sequence in 1L of sodium oxalate solution with a concentration of 10g / L at 35°C;

[0072] §2. Keeping at 35°C, add 25g of nickel sulfate, 5g of nickel acetate, 2g of manganese sulfate, 1g of zinc sulfate, and 0.5g of silver nitrate to the solution obtained in step §1, and stir until the various salts are completely dissolved;

[0073] §3. At 35°C, add 5g of water-soluble CS, 1g of oxalic acid, and 1g of malonic acid to the solution obtained in step §2, respectively, and stir until completely dissolved to obtain the main solution of chemical black nickel plating solution (main liquid);

[0074] §4. Dissolve 35g of sodium hypophosphite, 5g of glucose, 1g of hydroxylamine sulfate, and 2g of thioacetamide in 1L of water at 35°C to make a mixed reducing agent solution (reducing solution);

[0075] §5. Add the reducing...

Embodiment 2

[0078] A preparation method of chemical black nickel plating solution, prepared according to the following steps:

[0079] §1. Dissolve 2gSDS, 2gCTAB, 5gCS-Ni, 5gCSO-Ni in 1L sodium oxalate solution with a concentration of 15g / L at 45℃;

[0080] §2. Keeping at 45°C, add 45g of nickel sulfate, 10g of nickel acetate, 4g of an equal mass mixture of manganese sulfate and manganese nitrate, 2g of zinc nitrate, and 1g of silver nitrate to the solution obtained in step §1, and stir until various salts completely dissolved;

[0081] §3. At 45°C, add 5g of water-soluble chitosan and 3g of malonic acid to the solution obtained in step §2, and stir until the additives are completely dissolved to obtain the main solution;

[0082] §4. Dissolve the reducing agent: 55g of sodium hypophosphite, 10g of glucose, 3g of hydroxylamine sulfate, 4g of thioacetamide and thiopropionamide in 1L of water to prepare the reducing agent. stock solution;

[0083] §5. Add the reducing solution obtained i...

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Abstract

The invention discloses a preparation method and application of a chemical black nickel plating solution. The prepared chemical black nickel plating solution is convenient to use and good in stability. The method comprises the following steps: adding 3-8 g of a surfactant and 5-30 g of a nickel complex into 1 L of an aqueous solution with the concentration of an additive A being 10-35 g / L at the temperature of 35-55 DEG C, and sequentially dissolving; under the condition of 35-55 DEG C, 25-125 g of nickel sulfate, 5-30 g of nickel acetate, 2-12 g of manganese salt, 1-6 g of zinc compound and 0.5-3 g of silver nitrate are sequentially added into the obtained solution, and stirring is conducted till all the salts are completely dissolved; and 3-25 g of an additive B and 2-8 g of an additive C are sequentially added into the obtained solution at the temperature of 35-55 DEG C, stirring is conducted till the additive B and the additive C are completely dissolved, and the chemical black nickel main solution is obtained. A black nickel plating layer manufactured by the chemical black nickel plating solution is controllable in black degree, strong in adhesive force, excellent in brightness, good in corrosion resistance and excellent in conductivity, and industrial large-scale production is easy to realize.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a preparation method of an electroless black nickel plating solution, an electroless black nickel plating method and its application. Background technique [0002] Chemical black nickel and electrochemical black nickel are widely used. The black nickel coating is simple and elegant, and has excellent heat absorption, heat dissipation, extinction and decoration functions. It has multiple uses as an efficient light-absorbing material, such as in optical equipment, light-absorbing materials, It has a wide range of applications in aerospace and defense industries. Black nickel coating is also widely used in decoration and protective film, active solar thermal coating, and is used to absorb infrared light and other fields. [0003] In addition to the above applications, black nickel plating is also widely used as a conductive coating in the field of electronics industry, el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
CPCC23C18/36C23C18/1646
Inventor 彭迎兵李军鹏张文韬
Owner 东莞奕创表面处理科技有限公司
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