Environment-friendly adhesive and preparation method thereof

An adhesive and environmentally friendly technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of low adhesive viscosity and poor molding effect
CN114479754APending Publication Date: 2022-05-13滨海伟捷粘合剂有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
滨海伟捷粘合剂有限公司
Publication Date
2022-05-13

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Abstract

The invention provides an environment-friendly adhesive and a preparation method thereof, and relates to the technical field of adhesives. The environment-friendly adhesive is prepared from the following raw materials: polystyrene, bentonite, dimethyl sulfoxide, cellulose, sodium methylene dinaphthalene sulfonate and sodium silicate. The preparation method comprises the following steps: mixing polystyrene and dimethyl sulfoxide, adding a catalyst, and reacting at 80-90 DEG C for 15-20 hours to obtain a prepolymer; the preparation method comprises the following steps: mixing sodium silicate and cellulose, adding sodium methylene dinaphthalene sulfonate, and reacting at 100-120 DEG C for 1-2 hours to obtain a glue solution; vibrating and mixing the prepolymer and bentonite, adding the glue solution, stirring and mixing, extruding and forming, and drying. The environment-friendly adhesive is high in viscosity, good in forming effect, good in stability, not prone to decomposition, free of damage to the environment, safer, more environmentally friendly and capable of facilitating recycling of waste and has good economic benefits.
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Description

technical field

[0001] The invention relates to the technical field of adhesives, in particular to an environmentally friendly adhesive and a preparation method thereof. Background technique

[0002] Adhesives are divided into three categories: organic adhesives, inorganic adhesives and organic-inorganic composite adhesives. Organic adhesives include starch, sodium humate, papermaking waste liquid, etc., which have good bonding cold strength at room temperature, but when the temperature rises to 400°C, the adhesive will gradually decompose and the bonding ability will decrease. Inorganic binders mostly use clay, lime, and bentonite, which solve the defect of organic binders decomposing and losing bonding due to high temperature, but will increase the impurity content of the product, and increase energy consumption and slag production. However, the viscosity of the three types of adhesives is low, and the molding effect is not good. Contents of the invention

[0003] The ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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