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Surface-modified silica powder and preparation method thereof

A surface modification, silicon micropowder technology, applied in chemical instruments and methods, climate sustainability, sustainable manufacturing/processing, etc., can solve problems such as decreased EMC fluidity, unfavorable packaging molding process, and increased filling amount.

Inactive Publication Date: 2022-05-27
连云港威晟硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

To prepare such a high-performance EMC, the key technology is to increase the filling amount of silicon micropowder, but the content of silicon micropowder and the surface structure have a great influence on the fluidity of epoxy molding compound and the effect of integrated circuit packaging. The main disadvantage brought by the filling amount of large silica powder is that the fluidity of EMC is greatly reduced, which is not conducive to the packaging molding process

Method used

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  • Surface-modified silica powder and preparation method thereof

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Effect test

Embodiment 1

[0034] A method for preparing a surface-modified silicon micropowder, comprising the following steps:

[0035] (1) Select the natural quartz sand with a purity greater than 99.7% as the raw material, the selected particle size of the natural quartz sand is 0.1-3mm, first wash with water to remove the dust and impurities on the surface, then soak in an acid solution overnight, and then use deionized water. Wash until neutral and dry for later use;

[0036] (2) Transfer the quartz sand obtained in step (1) into a high-temperature furnace for melting treatment, the melting temperature is 1850° C., and the melting time is 12-14 h. After the temperature is lowered to room temperature, a high-purity quartz sintered body is obtained, and the The quartz sintered body was transferred to a ball mill, and a ball milling medium was added for ball milling. The ball milling medium was alumina balls with diameters of 3 cm, 4 cm and 5 cm in a weight ratio of 1:2.5:1.5, and the ball milling ti...

Embodiment 2

[0042] A method for preparing a surface-modified silicon micropowder, comprising the following steps:

[0043] (1) Select the natural quartz sand with a purity greater than 99.7% as the raw material, the selected particle size of the natural quartz sand is 0.1-3mm, first wash with water to remove the dust and impurities on the surface, then soak in an acid solution overnight, and then use deionized water. Wash until neutral and dry for later use;

[0044] (2) Transfer the quartz sand obtained in step (1) into a high-temperature furnace for melting treatment, the melting temperature is 1850° C., and the melting time is 12-14 h. After the temperature is lowered to room temperature, a high-purity quartz sintered body is obtained, and the The quartz sintered body was transferred to a ball mill, and a ball milling medium was added for ball milling. The ball milling medium was alumina balls with diameters of 3 cm, 4 cm and 5 cm in a weight ratio of 1:2.5:1.5, and the ball milling ti...

Embodiment 3

[0054] A method for preparing a surface-modified silicon micropowder is the same as in Example 2, except that the second modified graded micropowder further comprises the following processing steps:

[0055] S1. Weigh methyltriethoxysilane and dissolve it in absolute ethanol, add malonic acid and mix and stir evenly, leave standing overnight and then add aqueous ammonia solution, and continue to stand for 1-2 days after stirring for 5-6 hours; Dispersed solution is prepared after ultrasonic dispersion;

[0056] Wherein, the molar ratio of the solvent to the coupling agent is 32:1, and the molar ratio of the coupling agent to the malonic acid and the ammonia water is 1:0.01:0.82;

[0057] S2. Add the second modified graded micropowder into the dispersion solution, stir and mix for 1-2min, filter out, dry at 60-80°C, spread and transfer into a vacuum drying oven, cover with polydimethylformaldehyde Siloxane film, in nitrogen atmosphere, heated to 180-200 ℃ and kept for 1-3h.

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Abstract

The invention provides surface-modified silica powder and a preparation method thereof, and belongs to the field of electronic packaging materials, and the preparation method comprises the following steps: by taking natural quartz sand with the purity of more than 99.7% as a raw material, sequentially melting, crushing, grinding and grading, and then modifying the surface of the graded silica powder through surface modification. Through micro powder grading adjustment and surface modification treatment, the dispersibility of the silica powder in a resin melt is improved, and the fluidity of the resin melt is improved.

Description

technical field [0001] The invention relates to the field of electronic packaging materials, in particular to a surface-modified silicon micropowder and a preparation method thereof. Background technique [0002] Spherical silica micropowder refers to an amorphous quartz powder material whose particles are spherical and the main component is silicon dioxide. And has broad development prospects; spherical silicon powder is mainly used in large-scale integrated circuit packaging copper clad laminates and epoxy molding fillers, in aviation, aerospace, coatings, catalysts, medicine, special ceramics and daily cosmetics and other high-tech There are also applications in the field. [0003] At present, more than 95% of electronic components and integrated circuits are encapsulated by epoxy resin composite materials. The matrix resin used is mainly o-cresol epoxy resin, and the filler used is mainly silicon powder, which accounts for 70- 90%. With the development of integrated c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/28C09C3/04C09C3/06C09C3/08C09C3/12
CPCC09C1/28C09C3/006C09C3/04C09C3/041C09C3/043C09C3/06C09C3/063C09C3/08C09C3/12Y02P20/10
Inventor 朱兰昌李永洋
Owner 连云港威晟硅材料有限公司
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