SNS Josephson junction based on MoN and preparation method thereof
A junction barrier and top electrode technology, applied in the field of superconducting electronics, can solve the problems of large interface diffusion, unclear interface, and small interlayer reaction characteristic voltage, and achieve stable resistivity, high surface smoothness, and avoid layer The effect of interdiffusion
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Embodiment 1
[0053] This embodiment provides a method for preparing a MoN-based SNS Josephson junction, such as figure 1 As shown, it is shown as a flow chart of the preparation method of the SNS Josephson junction, comprising the following steps:
[0054] S1: providing a substrate;
[0055] S2: Form a functional material layer on the substrate, the functional material layer includes a stacked NbN bottom layer film, a MoN barrier layer, and a NbN top layer film, wherein the method for forming the MoN barrier layer includes DC reactive magnetron Sputtering method;
[0056] S3: Etching the functional material layer to form a bottom electrode, a MoN junction barrier layer, and a top electrode, and forming an isolation layer covering exposed surfaces of the bottom electrode, the MoN junction barrier layer, and the top electrode;
[0057] S4: forming a first contact hole and a second contact hole in the isolation layer, and the bottom of the first contact hole exposes the top electrode, and t...
Embodiment 2
[0096] This embodiment provides a MoN-based SNS Josephson junction, such as Figure 8 As shown, it is a schematic cross-sectional structure diagram of the SNS Josephson junction, and the MoN-based SNS Josephson junction is manufactured by using the preparation method of the MoN-based SNS Josephson junction described in Example 1.
[0097] Specifically, the MoN-based SNS Josephson junction includes the substrate 1, the bottom electrode 211, the MoN junction barrier layer 221, the top electrode 231, the isolation layer 3, the first The wiring part 41 and the second wiring part 42, wherein the substrate 1, the bottom electrode 211, the MoN junction barrier layer 221 and the top electrode 231 are stacked upwards, and the isolation layer 3 covering the exposed upper surface and side surfaces of the substrate 1, the bottom electrode 211, the MoN junction barrier layer 221 and the top electrode 231, and the bottom of the isolation layer 3 is provided to expose the top electrode The ...
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