Abrasive preparation device, polishing system and working method

Abstract

The invention provides an abrasive preparation device, a polishing system and a working method, and relates to the technical field of polishing equipment, the abrasive preparation device comprises a generation box, a stirring mechanism and a plurality of feeding mechanisms, and the stirring mechanism is arranged in the generation box; the feeding mechanism comprises a raw material box, a raw material pump and a raw material valve which are sequentially connected, the output end of the raw material valve communicates with the generation box, the raw material valve and the raw material pump are connected to the controller, and the controller is used for adjusting the discharging speed of the raw material box and the discharging ratio of different raw material boxes so as to adjust the particle size of the prepared abrasive in the generation box; aiming at the problem that an existing abrasive preparation device is inconvenient to adjust the grain size of polishing abrasives, various raw materials are used for manufacturing the abrasives, the abrasives with different grain sizes are obtained by adjusting the adding speed and proportion of the raw materials, and a polishing pump is kept to output a polishing solution while the grain size of the abrasives is adjusted; in the working process, polishing, recycling and preparing are continuously linked, work is independently carried out, mutual influence is avoided, and the working requirement of continuous polishing is met.

Description

technical field [0001] The invention relates to the technical field of polishing equipment, in particular to an abrasive preparation device, a polishing system and a working method. Background technique [0002] Polishing is an important work in the machining industry. By polishing the defects left on the surface of the workpiece to make the surface of the part smooth, it plays a vital role in improving the surface quality and performance of the workpiece. The existing technological process adopts mechanical methods such as sand and grinding, which can process the unevenness of the surface to a certain roughness, but cannot further improve the polishing accuracy; the technology of nano-silicon dioxide / titanium dioxide generation is relatively mature, but There are few applications in polishing; at the same time, due to the structural limitations of the existing polishing devices, in the polishing process, the specifications of the polishing liquid are relatively single and i...

AI Technical Summary

Problems solved by technology

The existing technological process adopts mechanical methods such as sanding and grinding, which can process the unevenness of the surface to a certain roughness, but cannot further improve the polishing accuracy; the technology for nano-silica / titanium dioxide generation is relatively mature, but It is rarely used in polishing; at the same time, due to the structural limitations of existing polishing devices, in the polishing process, the specification of polishing fluid is relatively single and it is difficult to achieve repeated use. Faced with different types and specifications of polishing materials, the same size of abrasive is often used Particle size, manual replacement of abrasives with different particle sizes reduces production efficiency, especially for mass production, the production cost and efficiency have a greater impact

[0003] Existing polishing devices have disadvantages such as relatively single specification of polishing fluid, high processing cost, low processing precision and unstable processing quality, which limit the application and production efficiency of polishing devices to a certain extent

Chinese patent application (publication number is CN101456164A) discloses a kind of fluid jet polishing process, controls the polishing process through the servo feed system, and its technological process includes three processes of polishing fluid preparation, polishing and polishing fluid recovery, and its abrasive grain size is in a certain range, but the particle size of the abrasive cannot be regulated in real time, and the abrasive cannot be generated at the polishing site; a Chinese patent application (publication number CN109514394A) discloses a water circulation swirl finishing machine for convenient replacement of abrasive, which can automatically discharge abrasive, clean The workpiece realizes water circulation, but the replacement of abrasives is still done manually to a certain extent, and the subsequent polishing process needs to be shut down to complete, which reduces the polishing efficiency. It is suitable for small batches and general workpiece polishing, not suitable for large batches and assembly line polishing.

The current polishing device is difficult to meet the demand for rapid adjustment of the polishing fluid specifications, and it is difficult to achieve continuous polishing work

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