Composite powder, preparation method thereof and application of composite powder in heat dissipation coating

A technology of composite powder and heat-dissipating coating, applied in the direction of coating, heat exchange materials, chemical instruments and methods, etc., can solve the problems of high lateral thermal conductivity and difficult dispersion of coating

Pending Publication Date: 2022-08-09
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the transverse thermal conductivity of the graphene-based heat dissipation coating in the prior art is much higher than the longitudinal thermal conducti

Method used

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  • Composite powder, preparation method thereof and application of composite powder in heat dissipation coating
  • Composite powder, preparation method thereof and application of composite powder in heat dissipation coating
  • Composite powder, preparation method thereof and application of composite powder in heat dissipation coating

Examples

Experimental program
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Effect test

Embodiment 1

[0032] 1.1 Preparation of composite powder

[0033] (1) Weigh 10g graphene (prepared by liquid phase exfoliation method, oxygen content is less than 3at.%, average lateral size is 22μm, sheet thickness is less than 3nm), 3g silica microspheres (particle size 3μm, surface modified with hydroxyl and Carboxyl, purchased from Zhongke Leiming Technology Co., Ltd.), 100g N-methylpyrrolidone (ACS, 98%), 0.5g epoxy organosilane (SH-023-7, Zaoyang Sihai Chemical Co., Ltd.), 0.2g 37% hydrochloric acid for use. In this embodiment, the graphene here is a powder with no groups and few defects, which is different from graphene oxide or modified graphene.

[0034] (2) 10g of graphene was added to 100g of N-methylpyrrolidone for shearing dispersion, the shear rate was 10000rpm, and the shearing time was 2h to obtain graphene dispersion liquid A.

[0035](3) 0.5 g of epoxy organosilane was added to the graphene dispersion liquid A obtained in step (2) and stirred evenly, and reacted in a c...

Embodiment 2

[0045] 2.1 Preparation of composite powder

[0046] (1) Weigh 10g graphene (prepared by liquid phase exfoliation method, oxygen content less than 3at.%, average lateral size 10μm, sheet thickness less than 3nm), 3g silica microspheres (particle size 10μm, surface modified with hydroxyl and Carboxyl group, purchased from Zhongke Leiming Technology Co., Ltd.), 1 kg of deionized water, 1 g of tannic acid (ACS), 10 g of KH560 silane coupling agent, for use.

[0047] (2) 1 g of tannic acid was added to 1 kg of deionized water, and stirred at 800 rpm for 0.5 h to obtain tannic acid solution A.

[0048] (3) 10g of graphene is added to the tannic acid solution A obtained in step (2) for shear dispersion, the shear rate is 10000rpm, and the shear time is 1h to obtain graphene dispersion liquid B.

[0049] (4) 10 g of KH560 silane coupling agent was added to the graphene dispersion liquid B obtained in step (3) and stirred evenly, and the temperature was raised to 90° C. for a consta...

Embodiment 3

[0059] 3.1 Preparation of composite powder

[0060] (1) Weigh 10g graphene (prepared by liquid phase exfoliation method, oxygen content is less than 3at.%, average lateral size is 22μm, lamella thickness is less than 3nm), 100ml concentrated sulfuric acid (98%), 2g potassium persulfate, 2g pentoxide Diphosphorus, 3 kg of deionized water, 3 g of silica microspheres (particle size 10 μm, surface modified with hydroxyl and carboxyl groups, purchased from Zhongke Leiming Technology Co., Ltd.), 10 ml of 37% hydrochloric acid, for use.

[0061] (2) 100ml of vitriol oil was added to the reactor, cooled to 0°C, then slowly added 2g potassium persulfate and 2g phosphorus pentoxide, stirred evenly and then heated to 80°C to obtain oxidant A.

[0062] (3) 10 g of graphene was added to the oxidant A obtained in step (2), stirred and reacted for 4 h, and then cooled to room temperature to obtain mixed solution B.

[0063] (4) Dilute the mixed solution B obtained in step (3) with 500 ml ...

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Abstract

The invention relates to composite powder which comprises graphene and silicon dioxide microspheres, the graphene and the silicon dioxide microspheres are combined together through chemical bonds, the average transverse size of the graphene is 5-30 [mu] m, and the particle size of the silicon dioxide microspheres is 0.5-20 [mu] m. The invention also relates to a preparation method of the composite powder and an application of the composite powder in a heat dissipation coating, and the application comprises the following steps: providing a heat dissipation coating through the composite powder, and then enabling the heat dissipation coating to form the heat dissipation coating. According to the composite powder and the silicon dioxide microspheres, the heat resistance of the coating can be improved, agglomeration of the graphene can be hindered, the dispersity of the graphene in the coating can be improved, the orientation distribution of the graphene in the coating can be changed, the orientation proportion in the direction perpendicular to a substrate is increased, and the heat resistance of the coating is improved. Therefore, the coating has excellent transverse and longitudinal heat-conducting properties at the same time.

Description

technical field [0001] The present invention relates to composite materials, and more particularly to a composite powder, its preparation method and application in heat dissipation coating. Background technique [0002] With the continuous development of science and technology, the power density of household appliances and electronic devices in daily life is increasing. What follows is a substantial increase in the amount of heat generated by various devices. If the waste heat generated by the electronic equipment cannot be dissipated to the surrounding environment in time and local hot spots are generated inside the equipment, the service life of the equipment will be shortened at light level, and the normal operation of the equipment will be affected or even cause potential safety hazards. [0003] Commonly used heat dissipation methods for existing high-power electrical appliances include active heat dissipation modes such as air cooling and water cooling. However, the ...

Claims

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Application Information

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IPC IPC(8): C09D7/62C09D7/61C09D183/04C09D179/08C09D163/00C08K9/06C08K9/04C08K3/04C08K7/18C08K9/02C09K5/14
CPCC09D7/62C09D7/61C09D7/70C09D183/04C09D179/08C09D163/00C09K5/14C08L2201/08C08K9/06C08K9/04C08K3/042C08K7/18C08K9/02
Inventor 曾宪喆丁古巧何朋
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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