Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Aeolotropic conductive film

A conductive thin film, anisotropic technology, applied in conductive connections, conductors, circuits, etc., to solve problems such as gaseous silicon generation, contamination of electronic components, errors, etc.

Inactive Publication Date: 2002-10-23
NITTO DENKO CORP
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when such an anisotropic conductive film is used for measurement at 150°C or higher, gaseous silicon may be generated from the film substrate and contaminate electronic components and / or circuit boards, thereby hindering electrical conductivity during the test. connected, or this silicon component may adhere to electronic components (semiconductor components) and / or circuit boards, causing errors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Aeolotropic conductive film
  • Aeolotropic conductive film
  • Aeolotropic conductive film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0025] The polycarbodiimide copolymer of formula (I) can be prepared, for example, by reacting polyalkylene carbonate diol with excess aromatic diisocyanate (i.e., carrying out urethanation between hydroxyl and isocyanate), followed by addition of mono Isocyanate is bonded to the end of the repeating structure, and the aromatic diisocyanate component is carbodiimidized using a carbodiimidization catalyst in the reaction system.

[0026] The above reaction is usually carried out in a suitable solvent. Usable solvents include alicyclic hydrocarbon solvents such as cyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, ethylbenzene, xylene, and cumene; alicyclic ethers such as tetrahydrofuran and dioxane; and ketone solvents such as Acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. These solvents may be used alone or in combination of two or more.

[0027] The reaction between polyalkylene carbonate diol and aromatic diisocyanate is usually ...

Embodiment 1

[0070] A mixture of toluene diisocyanate (2,4-toluene diisocyanate (2,4-TDI) and 2,6-toluene diisocyanate (2,6-TDI) (2,4-TDI:2,6-TDI=2: 8 (molar ratio)) (100g) and polyhexamethylene carbonate diol (100g), in a mixed solvent (100g) of xylene and cyclohexane, reacted at 100°C for 3 hours, and carried out urethanation reaction Subsequently, 3-methyl-1-phenyl-2-phosphine-1-oxide (0.883 g) and p-isopropylphenylisocyanate (6.47993 g) were added, followed by polymerization at 100° C. for 1 hour, A polycarbodiimide copolymer solution obtained from the copolymerization reaction of polyhexamethylene carbonate was produced, which was dried at 90°C for 30 minutes and at 200°C for 30 minutes to produce a thin film collecting polycarbodiimide Imine copolymer solid. The glass transition temperature of the solid was determined to be 130° C. The number average molecular weight of the solid was determined to be 6300.

[0071] A copper wire having a diameter of 18 µm was coated with the polycar...

Embodiment 2

[0078] A copper wire (18 microns in diameter) was coated with the polycarbodiimide copolymer synthesized above to prepare an insulated wire. By the above-mentioned method (A), a kind of anisotropic conductive film (thickness of film: 70 microns, distance (spacing) between the centerlines of conductive channels: average 50 microns) was prepared using the insulated wires, wherein the conductive channels were arranged at the highest density, The two ends (end surfaces) of each conductive channel are in the same plane as the top surface and the back surface of the film substrate, as shown in FIG. 1 . In the preparation stage, in order to melt the coating of the insulated wire to obtain the mass of the roll, the temperature was raised at a rate of 10°C / min and kept constant for 0.5 hours after reaching 200°C, and then the roll was cooled to room temperature. It was determined that the elastic modulus at 150° C. of the thus prepared anisotropic conductive film was 200 MPa.

[0079]...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
elastic modulusaaaaaaaaaa
Login to View More

Abstract

The invention provides an anisotropic conductive film, which can be firmly adhered to an electronic component and a circuit board by hot pressing at a low temperature without damaging the circuit board, and can achieve good electrical connection. Insulate and penetrate the conductive channel 2 of the film substrate 1A in the thickness direction of the film substrate, and the two ends 2a and 2b of each conductive channel are exposed to the top surface and the back surface of the film substrate, wherein the film substrate 1A is mainly composed of the following formula: (I) The polycarbodiimide copolymer composition of the structure represented: wherein m represents an integer of 2-50; n represents an integer of 1-30; x represents an integer of 1-10; A represents a urethane bond; R1 represents An alkylene group; R2 represents an aromatic diisocyanate residue; and R3 represents an aromatic monoisocyanate residue.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, and more particularly, the present invention relates to an anisotropic conductive film comprising a polycarbodiimide copolymer as a film base material. Background technique [0002] In recent years, anisotropic conductive films have been widely used as connector materials to electrically connect electronic components, such as semiconductor components (IC chips), and circuit boards. [0003] A generally known anisotropic conductive film is formed by dispersing conductive fine particles in a film base material made of an insulating resin. However, such anisotropic conductive films cause structural problems, including difficulty in precise connection with connection targets, and require connection targets, such as electrodes of semiconductor elements, to have protruding (unflat) ends. Therefore, WO98 / 07216 proposes an anisotropic conductive film, as an anisotropic conductive film capable of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/02C08J5/18C09J179/00H01B1/12H01B5/16H01L21/60H01R11/01H05K3/32
CPCH01B1/12H01L24/83H01L2224/8319H01L2224/838H01L2924/01004H01L2924/01005H01L2924/01013H01L2924/01015H01L2924/01025H01L2924/01027H01L2924/01029H01L2924/01033H01L2924/0105H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/01327H01L2924/0781H01L2924/14H01L24/29H01L2224/2919H01L2224/29298H01L2224/83101H01L2924/01006H01L2924/01019H01L2924/01024H01L2924/01087H01L2924/014H01L2924/0665H01L2224/29101H01L2924/00011H01L2924/00013H01L2924/00H01L2924/3512H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/2929C08J5/18
Inventor 山田美穗三隅贞仁堀田祐治
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com