High temp. resistance capsule, and its prepn. method

A technology of high temperature resistance and capsule, applied in the directions of microcapsule preparation and microsphere preparation, etc., can solve the problems of inability to have both sealing and heat resistance, low heat resistance temperature and low heat resistance temperature, and easy rupture of capsules, so as to improve emulsification. The effect of good effect, thermal stability and heat resistance, low production cost

Inactive Publication Date: 2003-12-03
TIANJIN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the molecular chain structure is a linear aromatic polyamide, its sealing performance is not good, and the capsule wall is relatively thin, and the capsule is easy to break
Although methyl methacrylate can be pre-dissolved in paraffin and polymerized with free radicals in the microcapsules to form an inner film, which improves the sealing performance of the microcapsules, the heat-resistant temperature of the microcapsules is lower than that of the aromatic polyamide body. The heating temperature is much lower, that is, the sealing and heat resistance cannot be achieved at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0025] Any known encapsulation technique can be used in the preparation process of the capsule of the present invention. The most commonly used method is interfacial polymerization or in-situ polymerization, especially the in-situ polymerization is more suitable for producing the capsules of the present invention, because the in-situ polymerization can effectively control the generated capsules according to the addition of wall materials and capsule cores. The wall of the capsule is thick, and the capsule core functional substance A and volatile substance B can be effectively coated inside the capsule, which is beneficial to the improvement of product quality.

[0026] The applicable capsule diameter range of the present invention is not limited, generally from 10 nanometers to 10 millimeters, preferably from 50 nanometers to 1 millimeter.

[0027] The shape of the capsule of the present invention is generally approximately spherical, and after heat treatment, the capsule will...

Embodiment 1

[0031] After heating and melting 40 grams of n-eicosane, mix it with 5 milliliters of hexanaphthene, add it to a solution of 20 grams of styrene-maleic anhydride copolymer emulsifier (19% aqueous solution) and 300 milliliters of distilled water, and emulsify at a high speed On the machine, emulsify at 8000 rpm for 90 minutes to obtain emulsion D, adjust the pH value of emulsion D to 3-5; Stir at 200 rpm until melamine is completely dissolved to obtain prepolymer E; Emulsion D is transferred to a 500ml three-necked flask, placed in a 70°C water bath, stirred at 600 rpm, and prepolymer E is slowly added dropwise, and the reaction continues after the drop is complete Emulsion F was obtained in 180 minutes. 10% sodium hydroxide solution adjusted the pH value of emulsion F to 7-9, filtered under reduced pressure, washed once with 100 ml of 25% hot ethanol, washed twice with hot water, and dried the filter cake to obtain microcapsules. The diameter of the capsule is in the range of...

Embodiment 2

[0033] 10 grams of n-hexadecane was heated and melted and mixed with 10 milliliters of n-heptane, and the rest of the raw materials and process conditions were the same as in Example 1. After testing, the heat-resistant temperature of the obtained capsule is 268° C., and the diameter of the capsule is in the range of 0.05-0.95 microns.

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Abstract

A high-temp. resistant capsule features that its capsule core contains at least one functional substance A and a volatile substance B which can dissolve capsule core but is insoluble in dispersing medium. The substance A is chosen from paraffin wax, chlorinated paraffin wax, high-grade emtrol and fatty acids, epoxy resin, perfume or essence and coloring agent. The substance B contains at least one hydrophobic substance whose boiling point is between ordinary temp. and 150 deg.C. Its preparing process features heat treatment of conventional capsule, that is, baking at 70-90 deg.C to constant weight and heat treating at 130-190 deg.C for 30-150 min. Its advantages are high resistance to high temp. up to 290 deg.C and low cost.

Description

technical field [0001] The invention relates to a high-temperature-resistant capsule and a manufacturing method thereof. Specifically, at least one functional substance is used as the capsule core, and a certain proportion of at least one volatile substance that can dissolve the capsule core but is insoluble in the dispersion medium is added to the capsule core. Substances, under the action of emulsifier and high-speed stirring, disperse the mixed solution formed by the capsule core and volatile substances in the dispersion medium, and wrap the capsule core with one or more high polymers that can form a film as the wall material, After the obtained capsules are dried to remove volatile substances, they are heat-treated to obtain high-temperature-resistant capsules. The international patent classification number is proposed to be Int.C1 7 C09K 5 / 06. Background technique [0002] Capsule technology is mainly used to adjust or change the apparent form or properties of origina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/02B01J13/06C09K21/14
Inventor 张兴祥樊耀峰王学晨牛建津
Owner TIANJIN POLYTECHNIC UNIV
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