Tin-zinc base plumbum-free solder alloy and its preparing technology

A lead-free solder and preparation process technology, applied in manufacturing tools, metal processing equipment, welding equipment, etc., can solve the problems of no large-scale commercial application, high raw material cost, complex process, etc., and achieve good cost performance and practicability , good development potential, simple preparation process

Inactive Publication Date: 2004-03-17
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For these technologies, from the perspective of the current production and application status of lead-free solder and its technology itself, first, there is no large-scale commercial application, and the efforts of various countries to research and develop lead-free solder have never stopped, and new related patents are still emerging. Second, the alloys containing silver, bismuth, indium and phosphorus have the disadvantages of high raw material cost and complex process. In fact, when the content of silver, bismuth and indium exceeds 2%, the alloy can no longer be regarded as a simple Tin-zinc-based alloy; in the evaluation as silver-bismuth-indium-tin-zinc composite alloy category
The technology of coating tin film on the surface of tin-zinc powder also has the disadvantages of complicated process and increased cost
[0005] Also, it is known that adding bismuth at higher levels, e.g. more than 3% by total weight, improves the wettability of tin-zinc alloys and lowers the melting point of the alloy, but higher bismuth makes the alloy brittle , and bismuth resources are less, and there is a certain degree of toxicity itself, so a large amount of bismuth cannot be an ideal solution

Method used

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  • Tin-zinc base plumbum-free solder alloy and its preparing technology
  • Tin-zinc base plumbum-free solder alloy and its preparing technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A preparation process of a tin-zinc-based lead-free solder alloy, wherein a tin-zinc-based lead-free solder alloy base material is melted and prepared in a resistance furnace with a graphite crucible, wherein the zinc content is 9.0% of the total weight of the alloy, and the surface is protected by graphite; The melting point of the prepared base metal was measured to be 198°C. The alloy was prepared by melting in a vacuum induction furnace; 100 grams of the base metal was melted in a corundum crucible in a resistance furnace and heated to 370°C, the red phosphorus powder was covered with tin foil, and the melt was quickly pressed into the melt and stirred. After holding for 10 minutes, the temperature was lowered to 300 ℃, cast into a round bar of φ20mm with an iron mold.

[0025] A series of tin-zinc-based alloys with different phosphorus contents were fused according to the above method for wettability measurement; the zinc content of the conventional tin-lead solder...

Embodiment 2

[0028] A preparation process of a tin-zinc-based lead-free solder alloy, wherein a tin-zinc-based lead-free solder alloy base material is fused in a resistance furnace with a graphite crucible, wherein the zinc content is 9.0% of the total weight of the alloy, and the surface is protected by graphite; The melting point of the prepared base metal was measured to be 198°C. Add single or mixed lanthanum and cerium in a vacuum induction furnace, and smelt to prepare a master alloy; melt 100 grams of base metal in a resistance furnace with a corundum crucible and heat it up to 350 °C, quickly press into the melt and stir, and keep it for 10 minutes. Cool down to 290°C, and cast it into a round bar of φ20mm with an iron mold

[0029] A series of tin-zinc-based alloys with different phosphorus contents were fused according to the above method for wettability measurement; the zinc content of the conventional tin-lead solder alloy for comparison was 37% of the total weight of the tin-l...

Embodiment 3

[0030] A preparation process of a tin-zinc-based lead-free solder alloy, wherein a tin-zinc-based lead-free solder alloy base material is melted and prepared in a resistance furnace with a graphite crucible, wherein the zinc content is 9.0% of the total weight of the alloy, and the surface is protected by graphite; The melting point of the prepared base metal was measured to be 198°C. Add single or mixed lanthanum and cerium in a vacuum induction furnace, smelt to prepare a master alloy, melt 100 grams of base metal in a resistance furnace with a corundum crucible and heat it up to 370 ° C, wrap the master alloy with tin foil, and quickly press into the melt And stir, and then wrap red phosphorus powder with tin foil, quickly press into the melt and stir, keep warm for 10 minutes, cool down to 290 ° C, and cast it into a φ20mm round rod with an iron mold.

[0031] According to the above method, a tin-zinc-based alloy with a phosphorus content of 0.009% by weight and a 1:1 weig...

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Abstract

The present invention relates to non-ferrous alloy material. The alloy contains Zn 4-11 wt%, P 0.001-1 wt%, except Sn, and may have some La and / or Ce. The preparation process of the alloy includes smelting Sn-Zn mother material with Zn content of 9.0 wt% and graphite protected surface in a resistive furnace; smelting intermediate alloy in a vacuum inducing furnace via adding La and Ce; melting the mother material inside a corundum crucible inside the resistive furnace and raising the temperature to 350 deg.c, pressing Sn foil coated intermediate alloy and red phosphorus powder into the melt quickly via stirring, maintaining the temperature for 10 min before reducing to 290-320 deg.c; and casting in iron mold into circular rod of 20 mm diameter. The alloy has copper moistening and spreading area greater than that of corresponding Sn-Zn alloy, up to 62 %.

Description

Technical field: [0001] The invention belongs to non-ferrous alloy materials, and relates to a lead-free brazing material for electronic devices, in particular to a tin-zinc-based lead-free brazing alloy and a preparation process thereof. Background technique: [0002] Various electronic devices, including microelectronic devices, generally use soldering as a means of circuit connection and assembly. For a long time, tin-lead eutectic and near-eutectic alloys have been used as solders due to their low melting point and good wettability to copper bases. Welding materials are widely used. With the expansion of the production and application scale of electronic products, the acceleration of replacement and the enhancement of human awareness of environmental protection, the potential harm of lead in a large number of waste electronic products to the environment and the human body has attracted great attention from the international community. lead solder restrictions and set a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 周浪魏秀琴黄惠珍吴一孙韡
Owner NANCHANG UNIV
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