Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices
A water-based dispersion and chemical-mechanical technology, applied in semiconductor/solid-state device manufacturing, grinding devices, chemical instruments and methods, etc., can solve problems such as insufficient performance and inability to obtain scratches on insulating films
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Embodiment 1
[0160] I. Preparation of water-based dispersion for chemical mechanical grinding
[0161] In a polyethylene bottle, put the water dispersion containing silica gel C25 for abrasive grains in turn, converted into silica equivalent to the amount of 0.5% by mass; for polyvinylpyrrolidone containing PVP K60 aqueous solution, converted The amount of polyvinylpyrrolidone is equivalent to 0.02% by mass; when alanine is used as a water-soluble complex compound generator, the amount is 0.3% by mass; when quinallic acid is used as an insoluble complex compound generator, 0.5% by mass Dosage; when used as a surfactant, potassium dodecylbenzene sulfonate is used in an amount of 0.1% by mass; when used as an oxidant, ammonium persulfate is used in an amount of 2% by mass. After adding potassium hydroxide to make the pH around 9, stir for 15 minutes. Next, ion-exchanged water was added so that the amount of all the constituent components reached 100% by mass, and then filtered with a filter with...
Embodiment 2～18 and comparative example 1～3
[0198] As described in Table 3 and Table 4, the type and amount of each component of the water-based dispersant for chemical mechanical polishing in Example 1 were changed. The others were the same as those in Example 1. The water-based dispersants for chemical mechanical polishing S2~S18 were prepared. And R1~R3. In order to make the pH of the aqueous dispersion approximately 9 as in Example 1, potassium hydroxide was added for adjustment. The pH values in Table 3 and Table 4 are all measured values after adding potassium hydroxide. The "-" in Table 3 means that the component in the corresponding column is not added. In addition, Examples 8-16 and 18 and Comparative Examples 2 and 3 used two kinds of particles in combination as abrasive particles. In Example 17, two water-soluble coordination compound generators were used in combination. In Example 18, two surfactants were used in combination. In Examples 8-15, 17 and 18 and Comparative Examples 2 and 3, two insoluble complex...
Embodiment 19
[0218] I. Tools for preparing water-based dispersions for chemical mechanical grinding
[0219] I-1. Preparation of liquid (I)
[0220] Put it in a bottle made of polyethylene material one by one, converted to silica equivalent to 0.6% by mass, as abrasive particles containing the above-mentioned prepared silica gel C15 water dispersion, and converted to silica equivalent to 0.4 A water dispersion containing silica gel C35 in the amount of mass%; an aqueous solution containing prepared PVP K95 as polyvinylpyrrolidone, equivalent to 0.06% by mass in terms of polyvinylpyrrolidone; propylene as a water-soluble complex compound generator The amount of acid 0.6% by mass; the amount of quinalic acid 0.6% by mass and the amount of quinolinic acid 0.4% by mass as a water-insoluble complex compound generator; and the amount of potassium dodecylbenzene sulfonate 0.2% by mass as a surfactant % And 0.2% by mass of the acetylene glycol surfactant (trade name Surfynol 465, manufactured by Air P...
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Abstract
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