Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process

A technology of metal substrate and resistance paste, which is applied in the direction of resistance manufacturing, circuit, conductive material dispersed in non-conductive inorganic materials, etc., to achieve the effect of improving process, improving manufacturability and promoting sintering

Active Publication Date: 2007-05-30
GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] According to the investigation, so far, there are no rare earth thick film circuits based on 1Cr15, 1Cr17, 00Cr12 (foreign brands 430#, 429#, 410L#) seri

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Precious metal rare earth resistor paste for rare earth thick film circuits for 1Cr15 (429#) series stainless steel substrates

[0035] 1. Glass-ceramic formula: SiO 2 32%, AI 2 o 3 18%, CaO 15%, Bi 2 o 3 16%, B 2 o 3 8%, La 2 o 3 5. TiO 2 4%, ZrO 2 2%,:

[0036] 2. Glass-ceramic preparation process: heat preservation at 1250°C for 135 minutes.

[0037] 3. Preparation and granulation: Vibration ball mill ball mill → star-shaped stirring ball mill → powder particle size ≮3μm

[0038] 4. Precious metal composition formula: the weight ratio of silver, palladium and yttrium composite powder is: 69:28:3. Composite powder particle size ≮2μm.

[0039] 5. Organic solvent formula dissolving process: terpineol 69%, tributyl citrate 12%, ethyl cellulose 5%, nitrocellulose 5%, hydrogenated castor oil 5%, lecithin 4%. Each component is mixed according to the proportion and then placed in a water bath at a water temperature of 80-90°C for 150 minutes.

[0040] 6...

Embodiment 2

[0047] Precious metal rare earth resistor paste for rare earth thick film circuits for 1Cr17 (430#) series stainless steel substrates

[0048] 1. Glass-ceramic formula: SiO 2 31%, AI 2 o 3 19%, CaO 14%, Bi 2 o 3 15%, B 2 o 3 9%, La 2 o 3 5. TiO 2 5%, ZrO 2 2%,:

[0049] 2. Glass-ceramic preparation process: heat preservation at 1250°C for 135 minutes.

[0050] 3. Preparation and granulation: Vibration ball mill ball mill → star-shaped stirring ball mill → powder particle size ≮3μm

[0051] 4. Precious metal composition formula: the weight ratio of silver, palladium and yttrium composite powder is: 70:27:3. Composite powder particle size ≮2μm.

[0052] 5. Organic solvent formula dissolving process: terpineol 69%, tributyl citrate 12%, ethyl cellulose 5%, nitrocellulose 5%, hydrogenated castor oil 5%, lecithin 4%. Each component is mixed according to the proportion and then placed in a water bath at a water temperature of 86°C for 150 minutes.

[0053] 6. C...

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PUM

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Abstract

This invention discloses one rare earth thick film circuit resistance plasma and its process method based on metal baseboard, wherein, the plasma is composed of function phase and organic load with proportion as 65-85:35- 15; the function phase is composed of palladium-silver-yttrium compound power and micro crystal power with proportion as 75-55:25- 45; palladium-silver-yttrium weight as proportion as 75-59:15-40.5:10-0.5. The rare earth resistance plasma process comprises the following steps: a, micro crystal glass powder processing; b, palladium-silver-yttrium compound processing; c, matching organic solvent load; d, processing rare earth plasma.

Description

Technical field: [0001] The present invention relates to rare earth resistor paste for thick film circuits based on metal substrates and its preparation technology, in particular to substrates based on ferritic stainless steel series, for example: national standard grades 1Cr15, 1Cr17, 00Cr12, etc., foreign grades 429#, 430#, 410L # and other high-power thick film circuit with rare earth resistor paste and its preparation process. Background technique: [0002] In the sustainable development strategy established by our country, the two aspects involved are environmental protection, improving energy utilization rate and improving energy structure. In the field of electric heating, new heating elements require small volume, high power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast thermal start, stable power, uniform temperature field, and process Good performance, automatic temperature control of the body, safe and relia...

Claims

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Application Information

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IPC IPC(8): H05B3/12H01B1/22
CPCH05B3/10H01C17/06533H05B2203/017H01C17/06553H05B2203/013
Inventor 王克政
Owner GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD
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