Rare earth thick film circuit rare earth resistance pastes based on metal substrate and its preparation process

A technology of metal substrate and resistance paste, which is applied in the direction of resistance manufacturing, circuit, conductive material dispersed in non-conductive inorganic materials, etc., to achieve the effect of improving process, improving manufacturability and promoting sintering
CN1972535AActive Publication Date: 2007-05-30GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUANGDONGSHENG YUCHEN ELECTRONICS & TECH CO LTD
Publication Date
2007-05-30
Patent Text Reader

Abstract

This invention discloses one rare earth thick film circuit resistance plasma and its process method based on metal baseboard, wherein, the plasma is composed of function phase and organic load with proportion as 65-85:35- 15; the function phase is composed of palladium-silver-yttrium compound power and micro crystal power with proportion as 75-55:25- 45; palladium-silver-yttrium weight as proportion as 75-59:15-40.5:10-0.5. The rare earth resistance plasma process comprises the following steps: a, micro crystal glass powder processing; b, palladium-silver-yttrium compound processing; c, matching organic solvent load; d, processing rare earth plasma.
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Description

Technical field:

[0001] The present invention relates to rare earth resistor paste for thick film circuits based on metal substrates and its preparation technology, in particular to substrates based on ferritic stainless steel series, for example: national standard grades 1Cr15, 1Cr17, 00Cr12, etc., foreign grades 429#, 430#, 410L # and other high-power thick film circuit with rare earth resistor paste and its preparation process. Background technique:

[0002] In the sustainable development strategy established by our country, the two aspects involved are environmental protection, improving energy utilization rate and improving energy structure. In the field of electric heating, new heating elements require small volume, high power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast thermal start, stable power, uniform temperature field, and process Good performance, automatic temperature control of the body, safe and relia...

Claims

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