7 results about "Yttrium compound" patented technology

The invention provides a method for manufacturing a high-strength aluminum oxide ceramic substrate, which comprises the following steps of: performing aluminum oxide particle surface heat treatment rounding on low-cost calcined and crushed aluminum oxide, adding at least one of a magnesium-containing compound, an yttrium-containing compound and a barium-containing compound into the rounded aluminum oxide powder, and adding into a solvent; the preparation method comprises the following steps: fully mixing the raw materials with slurry prepared from a dispersing agent, an adhesive and a plasticizer by virtue of a high-effect bead mill, dispersing, degassing, forming a green body, punching, carrying out two-stage sintering treatment and the like, thereby obtaining the high-density and high-strength composite material which is excellent in density and high in strength. The aluminum oxide substrate with thermal, electrical and mechanical properties, such as surface smoothness roughness of less than 0.05 mu m, high thermal conductivity (K) of more than 30W / mK, insulation characteristic of more than 1014 omega.cm, three-point breaking strength of more than 600MPa, and the like, is prepared from the aluminum oxide substrate.

Provided is a thin-film forming raw material, which is used in an atomic layer deposition method, including an yttrium compound represented by the following general formula (1):where R1 represents a secondary alkyl group having 3 to 8 carbon atoms, R2 represents a tertiary alkyl group having 4 to 8 carbon atoms, and R3 represents a hydrogen atom, or a primary, secondary, or tertiary alkyl group having 1 to 5 carbon atoms.

A display device having a substrate including a driving element and a light emitting element electrically connected to the driving element. A window layer is disposed on the substrate. A first adhesive layer is disposed on the window layer. The first adhesive layer includes a magnesium compound and an yttrium compound. A second adhesive layer is disposed on the first adhesive layer. A refractive layer is disposed on the second adhesive layer. The refractive layer includes a PFPE compound.

The present invention provides a plasma-sprayed film comprising a composite of a magnesium compound and a yttrium compound, wherein the composite comprises monoclinic yttrium oxide.

To obtain a dense yttria-stabilized zirconia layer.SOLUTION: An yttria-stabilized zirconia layer is obtained by applying a coating composition to the surface of a target object and curing it, wherein the coating composition is prepared by mixing a composition containing, as raw materials, zirconium acetate, an yttrium compound, a chelating compound, a catalyst, water, and an organic solvent, and wherein the content of zirconium acetate in the coating composition is 10 to 30 mass%, the content of the yttrium compound is 1 to 10 mass%, the content of the chelating compound is 3 to 10 mass%, the content of the catalyst is 0.1 to 2 mass%, the content of water is 5 to 15 mass%, and the content of the organic solvent is the balance.SELECTED DRAWING: Figure 1

The coating film of the present invention is formed on the surface of a vacuum chamber wall or internal component used for manufacturing semiconductors or display devices, wherein the coating film contains an yttrium compound, has resistance to plasma, and contains hydrogen in a predetermined ratio.

The invention discloses a high-thermal-conductivity diamond / copper-yttrium composite material and a preparation method thereof, and the preparation method comprises the following steps: mixing tungsten-plated diamond particles with copper-yttrium alloy powder, and then carrying out spark plasma sintering to obtain the composite material. According to the composite material, a copper yttrium compound / WC double-interface structure is formed, combination of diamond and a copper matrix is strengthened through a WC layer, and the interface combination condition of WC and the copper matrix is improved through a copper yttrium compound. By means of diamond surface tungsten plating modification and copper-yttrium matrix alloying, good bonding of a diamond / copper composite material interface is achieved, and the heat conductivity of the composite material can reach 600 W / (m * K) or above.