Chromium-free antitarnish adhesion promoting treatment composition

a technology of adhesion-promoting treatment and composition, which is applied in the direction of metal adhesion improvement, transportation and packaging, and other domestic articles, can solve the problems of increasing scrutiny of cr (vi) and failures in produced devices, and achieve the effect of enhancing adhesion of a polymer

Inactive Publication Date: 2005-06-09
HOWELL LEONARD R +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] In another aspect, the present invention is directed to a material coated with an antitarnish and adhesion treatment coating, comprising: zinc or zinc oxide atoms; and metal or metal oxide atoms selected from the group consisting of tungsten, molybdenum, cobalt, nickel, zirconium, titanium, manganese, vanadium, iron, tin, indium, silver, and combinations thereof; wherein the coating is substantially free of chromium, and wherein the coating provides a tarnish resistance at least for 30 min at 250° C., and wherein the coating contains nodular structures that enhance adhesion of a polymer to the material.

Problems solved by technology

This generation of water vapor is believed to be the cause of device failure due to cracks and delamination.
However, sodium and potassium ions suffer a disadvantage in that these ions could potentially diffuse into the silicon die and cause failures in the produced devices.
Although Cr(VI)-containing plating baths have been used throughout the world for decades, the use of Cr (VI) is coming under increasing scrutiny due to growing concerns with health and environmental effects.

Method used

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  • Chromium-free antitarnish adhesion promoting treatment composition
  • Chromium-free antitarnish adhesion promoting treatment composition
  • Chromium-free antitarnish adhesion promoting treatment composition

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0043] A C110 copper foil (>99.9% Cu and 4.7H2O, 10 g / L (NH4)2SO4 and 25 ppm W (tungsten, as tungstosilicic acid). A plating current of 10 amperes per square foot (ASF) was applied to an area of 0.035 ft2 for 2, 5 and 10 second intervals. The sample was then rinsed and dried. FIGS. 1(a), 1(b), and 1(c) show scanning electron micrographs (SEMs) of the treated surfaces at the three time intervals. In each case, the nodular morphology is visible.

[0044] The copper foil sample was subjected to a tape test using a Scotch 600 tape. The tape was first pressed onto the plated surface and then pulled away from the surface. The glue was visibly left behind on the plated sample, indicating that a nodular structure was deposited onto the copper foil.

[0045] The sample was further subjected to a 250° C. bake for 30 minutes. The sample showed no oxidation after the bake, while an untreated portion was heavily oxidized. This result indicated that the deposited coating provided a good tarnish resis...

example 2

[0046] A C110 copper foil sample having pure copper dendrites on one side and bare on the other was dipped in 5 wt % H2SO4 for 30 seconds to remove any existing surface oxides. The sample was placed in a fixture that exposes only one surface to an aqueous plating composition containing 10 g / l ZnSO4.7H2O, 20 g / l (NH4)2SO4 and 25 ppm W, and a plating current of 10 ASF was applied to an area of 0.104 ft2 for 5 sec. The sample was then rinsed and dried. The procedure was repeated on a second sample exposing the opposite surface to the same solution and plating current. The samples were further subjected to a 95° C. / 55% RH test for 60-min to simulate a long-term storage in a hot and humid condition. The sample was subsequently baked for 30 min at 190° C. and showed no oxidation. The untreated portion was heavily oxidized. This indicated that the coating provided a good tarnish resistance.

example 3

[0047] A C110 copper foil was electrocleaned in a commercial alkaline cleaner to remove the residual lubricant, contaminants, and oxides from the surface. A plating current of 5 ASF was applied to an area of 0.035 ft2 for 5 sec in a solution containing 5 g / l ZnSO4.7H2O, 3 g / l NiSO4.6H2O, 50 ml KMnO4 N / I 0 and 2.5 ml / l MITIQUE (inorganic acid composition that contains 1-3% ammonium molybdate; Hubbard Hall, Waterbury, Conn.). The sample was then rinsed and dried, and subjected to a tape test using a Scotch 600 tape. The tape was first pressed onto the plated surface and then pulled away from the surface. The glue was visibly left behind on the plated sample. This result indicates that a nodular structure was deposited.

[0048] The sample was further subjected to a 250° C.×10-min bake test and the sample showed no oxidation after the bake. The untreated portion was heavily oxidized. This result indicated that the coating provided a good tarnish resistance.

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Abstract

The present invention is directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, titanium ions, manganese ions, vanadium ions, iron ions, tin ions, indium ions, silver ions, and combinations thereof; and optionally, an electrolyte that does not contain potassium or sodium ions; wherein the treatment composition is substantially free of chromium, and wherein the treatment composition forms a coating on a substrate or material that enhances adhesion of a polymer to the material. The present invention is also directed to materials coated with the above treatment composition, and methods of coating materials using the above composition.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention is directed to tarnish-resistant and adhesion promoting treatment compositions, and more particularly to tarnish-resistant and adhesion promoting treatment compositions that are substantially free of chromium. [0003] 2. Brief Description of the Art [0004] Tarnish resistance of metal and tenacious adhesion between metals and polymer has been long sought for various applications such as printed circuits, electronic packaging, automotive body trim (aluminum to PVC or ABS plastics, for example), steel belted tires, and paint or other polymeric coatings. For example, the tarnish resistance of Cu foil for printed circuit application is required for shelf life and to withstand the heat exposure during lamination and soldering in printed circuit processing. The antitarnish coatings also prevent the oxidation of Cu and reaction with the polymeric substrate upon humidity and temperature exposures during ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B15/00B32B15/04C23C22/40C23C22/48C23C22/52C23FC25D3/56C25D11/32H05K3/28H05K3/38
CPCC23C22/40C25D3/565H05K3/282H05K3/385H05K2203/135Y10T428/12993Y10S428/901Y10T428/12792Y10T428/12438Y10T428/12472Y10T428/1291Y10S428/935Y10T428/31678B32B15/04C25D11/32
Inventor HOWELL, LEONARD R.CHEN, SZUCHAIN F.
Owner HOWELL LEONARD R
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