Front end module

Abstract

A front end module includes a multilayered structure. The multilayered structure includes a transmitter, a receiver, and a duplex unit. The multilayered structure further includes a ground layer. The ground layer includes a ground pattern having at least one block on a surface of a substrate of the front end module.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a front end module used in a mobile communication device.[0003]2. Description of the Related Art[0004]The front end module (FEM) is a transmitting / receiving device used in a mobile communication device to control an electric wave signal. The FEM is a complex component on which a plurality of electronic components is mounted in a single substrate.[0005]For example, a conventional FEM for processing a code division multiple access (CDMA) will now be described.[0006]FIG. 1 is a circuit block diagram of a conventional CDMA FED.[0007]Referring to FIG. 1, a conventional CDMA FEM includes a duplexer 20, a receiver 30, and a transmitter 40. The transmitter 40 includes a transmitting process module 46 (a Tx BBA or RF transmitter), transmitting filter 44, and a power amplifier module (PAM) 42. The receiver 30 includes a low noise amplifier (LNA) 32, a receiving filter 34, and an receiving process ...

AI Technical Summary

Benefits of technology

"The present invention provides a front end module (FEM) that solves problems in existing technology. It improves solderability and grounding efficiency by forming a ground pattern in multiple blocks. It also stably performs communication functions without a barrier structure. It reduces the size of components and simplifies the mounting structure of components. It effectively arranges components and reduces impedance for the duplexer unit. It provides stable power supply even in variable power state or noise component input state. It improves receiving performance by integrating an amplifier with the receiving process unit. It simplifies a matching circuit unit and lowers the impedance for the duplexer unit. It removes phase noise components of power from a voltage controlled oscillator circuit. It includes a multilayered structure with a ground layer having a ground pattern with at least one block on a surface of a substrate. It includes a switching circuit unit and a passive device unit to control the amplifying function of the power amplifier module and stabilize the power voltage."

Problems solved by technology

First, the conventional FEM has the following structure problems of the substrate.

However, there is a limitation in preventing the electric wave interference between devices using the barrier.

Therefore, the overall process is complicated and the process treating time increases.

However, the chip inductor is relatively expensive and requires a space for the surface mounting.

This makes it difficult minimize the mobile communication device in which a multi chip module (MCM) is mounted.

Second, the conventional FEM has a variety of problems in the overall operational function.

Furthermore, a noise component is inputted together with electric power, the performance of the PAM 42 may be unstable.

Therefore, when the performance improvement for certain terminal impedance is done by adjusting an impedance of a bonding portion in the device, it is impossible to realize the performance improvement in the convention complex module.

However, when the VCO is designed in a single module according to the prior art, phase noise may be mixed, thereby deteriorating the performance of the receiving unit.

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