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Method for producing microelectromoulding metal mould

A manufacturing method and metal mold technology, applied in electroforming, electrolysis process, etc., can solve problems such as low quality of plastic products, and achieve the effects of improving productivity, high surface finish, and reducing internal stress

Inactive Publication Date: 2008-05-28
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The micro-electroforming metal mold based on this method has the advantages of verticality of the side wall and good surface finish, and solves the problem of low quality of polymer and plastic products based on the large-scale and low-cost production of the molding method and hot pressing method

Method used

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  • Method for producing microelectromoulding metal mould
  • Method for producing microelectromoulding metal mould
  • Method for producing microelectromoulding metal mould

Examples

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Embodiment Construction

[0013] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. For example: on the finely ground and polished nickel substrate 1 (63×63mm), a metal micro-mold in the shape of a “line” (45mm×80um) is electroformed, and the mold is made according to the process figure 1 The specific steps are as follows:

[0014] 1. Pretreatment of mold base The pretreatment of mold base is divided into two parts: mechanical processing pretreatment and surface cleaning. In order to reduce the difference in physical properties between the base metal and the electroforming deposited metal, especially in terms of stretching deformation, high-purity nickel metal is selected as the base material. The machining process of the nickel substrate includes in sequence: milling, grinding, fine grinding, wire cutting and polishing. Finally, meet the requirements of certain surface roughness, flatness and smoothness. The ...

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Abstract

The microelectromolding metal mold making process belongs to the field of micro machine building technology. The microelectromolding metal mold making process includes the steps of: pre-treatment of mold base, making microelectromolding mother mold, microelectromolding, post-treatment and detection. The present invention adopts so-called 'no-back board growth process', in which micro structure pattern is electromolded directly on nickel substrate via ultraviolet irradiation on photoetching mask. During making microelectromolding mother mold, one seed layer is added between the SU-8 photoresist and the substrate; and in the post-treatment, vacuum annealing is adopted. The microelectromolding metal mold made in the method of the present invention has the merits of high side wall verticality and high surface smoothness. The present invention is suitable for fine machining of organic polymer, including plastic.

Description

technical field [0001] The invention belongs to the field of micro-electroforming metal molds of micro-manufacturing technology. Background technique [0002] Micro-electroforming metal molds have been developed because of their high precision and technical requirements, and their long service life and outstanding economy to meet the needs of mass production. At present, the micro-electroforming metal mold has become the core device of the molding method and the hot pressing method, and is widely used in the micro-processing of organic polymers and plastics. The existing micro-electroforming metal mold manufacturing method is based on the "back plate growth method" of the silicon substrate, such as the magazine "Chemical Journal of Higher Schools" in 2003, No. 11, pages 1962-1966 and the magazine "Microfabrication Technology" in 2002 Issue 4, pages 61-65, provides "Backplate Growth Method". The process flow of the backplane growth method is as follows: first grow silicon d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/10
Inventor 杜立群罗怡刘冲娄志峰肖日松薛琳张永彩
Owner DALIAN UNIV OF TECH
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