Method for preparing micron/submicron metal ring and open-mouth metal ring
A metal ring and sub-micron technology, applied in chemical instruments and methods, separation methods, microstructure technology, etc., can solve the problems of complex micromachining technology, high cost, and long time consumption of equipment, and achieve low equipment requirements and low cost , good effect of monodispersity
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Embodiment 1
[0018] Example 1: The diameter of the selected micron / submicron silica microspheres is 1550nm (between 200nm and 10μm), the filled polymer is polystyrene (PS) (or other organic polymers), and the metal is sputtered The material is gold. The preparation method of two-dimensional ordered micron / sub-micron gold ring is:
[0019] 1. Non-close-packed hemispherical SiO 2 Preparation of ordered arrays. Arrange SiO on silicon substrate by self-assembly technology 2 , To obtain a large area and highly ordered two-dimensional single-layer microsphere array; then after high temperature annealing at 1250℃ for 15min, 40% HF solution steam corrosion for 1~3.5min, to obtain non-close-packed SiO 2 Ordered array, see figure 2 (A); perform a second annealing at 1300℃ for 10 minutes to form a non-close-packed hemispherical SiO 2 Ordered array, see figure 2 (B), (the temperature of the high-temperature annealing treatment is 1250~1300℃, and the annealing time is within the range of 10~15min).
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Embodiment 2
[0022] Example 2: Preparation of two-dimensional ordered micron / sub-micron gold split ring: The preparation process is basically the same as that of Example 1, but after obtaining PS / SiO 2 After the ring-shaped porous template is immersed in an alcohol solution, the template is slowly taken out at an angle. This process causes the PS porous membrane to move slightly until the boundary of the PS pore touches the SiO in the pore 2 , Thus obtained the open ring PS / SiO 2 Porous template, see figure 2 (D); After sputtering gold on the template and removing the template by the same method as in Example 1, a hexagonal non-close-packed two-dimensional ordered micron / submicron gold split ring array is obtained, and the outer boundary of the split metal ring is a circle Shape, and the inner cavity is a U-shaped structure, see image 3 (B), the adjustable range of its size parameter is the same as that of Example 1.
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